A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

A sealing composition and a sealing method for a coated electric cable have excellent sealing performance even under conditions such as cooling-heating cycles or high temperature and humidity. The coated electric cable sealing composition is for sealing a core wires connection section formed by electrically connecting multiple core wires exposed from multiple coated electric wires, and features having a hardening time of 10 minutes or less at 130° C., and permeating to inside of the coated electric wires at a height of 5 mm or more at the time point of hardening while the exposed parts of the core wires including the core wires connection section and the boundary part between the coated parts and the exposed parts of the core wires are immersed perpendicularly in the coated electric cable sealing composition filled in a resin cap and the sealing composition is heated to be cured.

A sealing composition and a sealing method for a coated electric cable have excellent sealing performance even under conditions such as cooling-heating cycles or high temperature and humidity. The coated electric cable sealing composition is for sealing a core wires connection section formed by electrically connecting multiple core wires exposed from multiple coated electric wires, and features having a hardening time of 10 minutes or less at 130° C., and permeating to inside of the coated electric wires at a height of 5 mm or more at the time point of hardening while the exposed parts of the core wires including the core wires connection section and the boundary part between the coated parts and the exposed parts of the core wires are immersed perpendicularly in the coated electric cable sealing composition filled in a resin cap and the sealing composition is heated to be cured.

Compounds containing, in one molecule thereof, a structure represented by formula (1), a structure represented by formula (2), and a structure represented by formula (3) (all the symbols are those described in the specification).

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are useful as epoxy resin curing agents.

The invention relates to a method for producing a cured composition which has at least one oxazolidinone ring and at least one isocyanurate ring and is cross-linked by the same, starting from a liquid reactive mixture which, based on the total weight thereof, contains at least one epoxy resin, at least one polyisocyanate, at least one polyol, and at least one catalyst composition. The invention further relates to the cured composition obtainable thereby.

A method to synthesize a low thermal expansion thermoset comprises mixing a thermosetting resin and a benzocyclobutene curative having a reactive secondary functionalization; heating the mixture to a first temperature to from a pre-polymer comprising benzocyclobutene end groups and a thermoset linking group; and heating the pre-polymer to a second temperature sufficient for ring-opening of benzocyclobutene to occur, thereby forming a thermoset polymer network crosslinked with dibenzocyclooctene moieties.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

A process is disclosed for the production of an epoxy resin. This process includes providing lignin, one or more acids and/or esters derived from epoxidized vegetable oil(s), optionally a solvent and optionally a catalyst, to form a reactive mixture. The reactive mixture is mixed and cured in the presence of a curing agent to form the epoxy resin.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.