Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

The present invention provides: a two-pack curable epoxy resin composition that contains a curing agent having excellent long-term storage stability, has a low viscosity and a good impregnation property into fibers; the cured product; a fiber-reinforced composite material; and a molded article. Specifically, the two-pack curable epoxy resin composition is used, the two-pack curable epoxy resin composition containing: a main agent (i) containing an epoxy resin (A); and a curing agent (ii) containing an acid anhydride (B) and an organic phosphorus compound (C), in which a mass ratio [(i)/(ii)] of the main agent (i) to the curing agent (ii) is in a range of 35/65 to 75/25, and an amount of the organic phosphorus compound (C) used is in a range of 0.5 to 5 parts by mass with respect to 100 parts by mass in total of the epoxy resin (A) and the acid anhydride (B).

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

A process is disclosed for the production of an epoxy resin. This process includes providing lignin, one or more acids and/or esters derived from epoxidized vegetable oil(s), optionally a solvent and optionally a catalyst, to form a reactive mixture. The reactive mixture is mixed and cured in the presence of a curing agent to form the epoxy resin.

A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.

A curing agent composition comprising anhydride and approximately equimolar amount of tertiary amine or imidazole and carboxylic acid, the amine being 1-piperidinylethanol (N-hydroxyethyl-piperidine, NHEP) represented by the structure below or an imidazole represented by the structure below: ##STR00001##
where R.sub.1=H, a C1-C20 straight chain or branched alkyl, or a monocyclic aryl; R.sub.2=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The carboxylic acid is represented by RCOOH; R=a C1-C20 straight chain or branched alkyl, or a monocyclic aryl. The composition comprises a lower ratio of epoxy resin to anhydride (1:0.4-0.6) than typically used (1:0.8-1.1). In addition, it uses a higher loading of the hindered latent tertiary amine or the imidazole in combination with the carboxylic acid (wt % ratio of combined amine and carboxylic acid to anhydride ˜10%). With this composition a full cure can be achieved in less than 2 hr at a significantly lower temperature (˜100° C.).

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): ##STR00001##
wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): ##STR00002##
wherein Y is a bond, a C.sub.1-6 alkylene group, etc.; R.sup.1 is the same or different, and is a C.sub.1-18 alkyl group, etc., R.sup.2 is the same or different, and is a C.sub.1-18 alkylene group, etc., R.sup.3 is the same or different, and is a C.sub.1-18 alkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.