Provided is an epoxy resin composition containing an epoxy resin (A), a curing agent (B) and an imidazole adduct-type curing accelerator (C), in which the curing agent (B) contains a compound (B-1) represented by formula (B-1) [R.sup.1 represents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms] and a compound (B-2) represented by formula (B-2) [R.sup.2 represents a hydrogen atom, a halogen atom, a methyl group or a methoxy group] and the content of the compound (B-2) is 2 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the epoxy resin (A).

The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.

Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

A curing agent component is useful for a multicomponent epoxide resin composition. An epoxide resin composition produced using the curing agent component, wherein the curing agent component includes, as a curing agent, at least one Mannich base and an amine that is reactive with respect to epoxide groups, as well as at least one polyphenol from the group of novolac resins as an accelerant. The Mannich base can he obtained by reacting a phenolic compound selected from phenol, styrenated phenol, catechol, resorcinol, hydroquinone, hydroxyhydroquinone, phloroglucinol, pyrogallol, o-cresol, m-cresol, p-cresol and bisphenols, with an aldehyde or an aldehyde precursor and an amine having at least two active hydrogen atoms in the molecule which are bonded to a nitrogen atom. The novolac resin is contained in the curing agent component in a proportion of 5-30 wt. %, based on the organic proportions of the curing agent component.

An epoxy resin mixture which contains an epoxy resin represented by Formula (1) below and an epoxy resin represented by Formula (2) below at a weight ratio of 1:5 to 1:0.2. (In Formula (1), plural R1's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represent a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.) (In Formula (2), plural R2's and R3's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

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Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R.sup.5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3. ##STR00001##

A dust core includes a binder and magnetic particles. The binder includes an epoxy resin. The magnetic particles are dispersed in the binder. The epoxy resin has at least two or more mesogenic skeletons between two epoxy bonds adjacent along a molecular chain.

This invention provides a polymer, which is preferably a polyether polymer. The polymer may be uses in coating compositions. Containers and other articles comprising the polymer and methods of making such containers and other articles are also provided. The invention further provides compositions including the polymer (e.g., powder coatings), which have utility in a variety of coating end uses, including, for example, valve and pipe coatings.

Provided are a resin composition, which is used for transfer molding, including a resin (A), a magnetic powder (B) having a median diameter of 7.5 to 100 μm, and particles (C) having a median diameter of 0.2 to 5 μm, in which a saturation magnetic flux density of a molded article obtained by transfer molding the resin composition at 175° C. is equal to or more than 1.1 T; and a molded article formed of the resin composition. The particles (C) may include a magnetic powder or a non-magnetic powder.