The present disclosure relates to a coating method of implant using parylene, for coating a surface of a dental implant, including a pretreating step of pretreating the implant; and a coating step of coating a surface of the pretreated implant with a coating material to form a polymer coating layer, wherein the coating material is provided as parylene.

According to the present disclosure, a parylene thin film may be uniformly coated on the surface of the dental implant, and according to such a thin film, the growth of anaerobic bacteria can be effectively inhibited in spaces where the fixture and the upper structure of the dental implant are joined to each other, and where the upper structure and the crown are joined to each other.

The present disclosure provides a composite coating and a method for fabricating the composite coating. The composite coating comprises a polymer layer, a metal interlayer and an amorphous metal coating. The polymer layer is formed on a substrate and acts as a diffusion barrier layer, which is thick and dense enough to prevent the corrosive substances from penetrating into the substrate. The metal interlayer is formed between the polymer layer and the amorphous metal coating for improving the adhesion of the amorphous metal coating to the substrate.

Boron nitride nanotube (BNNT)-polymide (PI) and poly-xylene (PX) nano-composites, in the form of thin films, powder, and mats may be useful as layers in electronic circuits, windows, membranes, and coatings. The processes described chemical vapor deposition (CVD) processes for coating the BNNTs with polymeric material, specifically PI and PX. The processes rely on surface adsorption of polymeric material onto BNNTs as to modify their surface properties or create a uniform dispersion of polymer around nanotubes. The resulting functionalized BNNTs have numerous valuable applications.

A liquid lens including (i) a first liquid and a second liquid disposed within a containment region, the first liquid and the second liquid forming an interface between the first liquid and the second liquid; (ii) an electrode; and (iii) an insulating layer separating the electrode from the first liquid and the second liquid, the insulating layer comprising a polymeric material and a slippery omniphobic covalently attached liquid that is chemically bonded to the polymeric material, the slippery omniphobic covalently attached liquid providing a surface contacting one or more of the first liquid and the second liquid. The polymeric material of the insulating layer can be a poly(para-xylylene). The slippery omniphobic covalently attached liquid can include units of a silicone or polyolefin, each unit individually bound to a repeating unit of the polymeric material. A liquid lens where the insulating layer has a quality factor at least 200.

A composition for forming a resist underlayer film exhibits strong etching resistance, has a good dry etching rate ratio and a good optical constant, and is capable of forming a film that provides good coverage over a so-called multilevel substrate and that is flat with reduced difference in thickness after embedding. A resist underlayer film uses said composition for forming a resist underlayer film; and a method for producing a semiconductor device. The composition for forming a resist underlayer film contains: a polymer having the partial structure represented by formula (1); and a solvent. (In the formula, Ar represents an optionally substituted C6-20 aromatic group.)

The present invention can provide a salt capable of producing a resist pattern with satisfactory CD uniformity (CDU), and a resist composition. A resist composition comprising a resin including a structural unit having an acid-labile group, an acid generator and a compound represented by formula (I): ##STR00001##
wherein, in formula (I), R.sup.1 represents a hydrocarbon group having 1 to 36 carbon atoms which may have a substituent, X.sup.1 represents *—CO—O—, *—O—CO—, *—O—CO—O— or *—O—, and * represents a bonding site to R.sup.1, L.sup.1 represents a single bond or a hydrocarbon group having 1 to 36 carbon atoms which may have a substituent, and —CH.sub.2— included in the hydrocarbon group may be replaced by —O—, —S—, —CO— or —SO.sub.2—, R.sup.2 represents a saturated hydrocarbon group having 1 to 12 carbon atoms, u1 represents an integer of 0 to 2, s1 represents 1 or 2, t1 represents 0 or 1, in which s1+t1 is 1 or 2, n represents an integer of 2 or more, and a plurality of X.sup.1, L.sup.1, s1, t1, R.sup.2 and u1 each may be the same or different from each other.

The present invention provides a method of forming N-hydroxysuccinimide ester-functionalized paracyclophane. The present method is carried out by adding 4-carboxyl-paracyclophane into N,N′-Dicyclohexylcarbodiimide (DCC) and N-Hydroxysuccinimide (NHS) to form N-hydroxysuccinimide ester-functionalized paracyclophane. The present invention further provides a chemical film on a substrate and a method of forming the same, wherein the chemical film includes N-hydroxysuccinimide ester-functionalized poly-para-xylylene.

A tackifier comprising a resin with repeating units of formula (I) wherein R.sup.1 is a linear or branched alkylen group with 1 to 10 carbon atoms and R.sup.2 is a linear or branched, saturated or unsaturated aliphatic hydrocarbon group with up to 20 carbon atoms and a non-aromatic compound which consists to at least 50% by weight of one or more linear or branched, saturated or unsaturated aliphatic hydrocarbon groups with at least 4 carbon atoms. ##STR00001##

This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

The present invention discloses an organic polymer film and a manufacturing method thereof. The organic polymer film is mainly manufactured by the following steps. Firstly, the step (A) provides a xylene precursor and a substrate, and the step (B) places the substrate inside of a plasma equipment. After that, the step (C) evacuates the plasma equipment while introducing a carrier gas which carries vapor of the xylene precursor, and the step (D) turns on a pulse power supply system of the plasma equipment, generating a short pulse for plasma ignition. Finally, the step (E) forms the organic polymer film on the substrate. In the aforementioned steps, the frequency of the short pulse plasma is between 1 Hz˜10,000 Hz, and the pulse period of the short pulse plasma is between 1 μs˜60 μs.