C08G63/185

POLYARYLATE RESIN AND ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER

A polyarylate resin includes repeating units (1), (2), and (4).

##STR00001##

The polyarylate resin further includes a repeating unit (3) and a percentage of the number of repeats of the repeating unit (3) relative to the total number of repeats of each of the repeating units (1) and (3) is greater than 0% and less than 50%. Alternatively, the polyarylate resin does not include the repeating unit (3).

THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY USING SAME

One embodiment of the present invention provides: a thermoplastic resin composition which contains a polycarbonate resin and a polyester resin that contains a diol unit having a cyclic acetal skeleton, and wherein the polyester resin contains specific amounts of phosphorus atoms and titanium atoms and the weight ratio of the phosphorus atoms to the titanium atoms is within a specific range; and a molded body which uses this thermoplastic resin composition.

Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m.Math.K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m.Math.K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m.Math.K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m.Math.K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

NEW PHENOLIC POLYMERS AND PREPARATION PROCESSES THEREOF

The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

##STR00001##

NEW PHENOLIC POLYMERS AND PREPARATION PROCESSES THEREOF

The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

##STR00001##

CRYSTALLINE WHOLLY AROMATIC POLYESTER AND POLYESTER RESIN COMPOSITION
20210388156 · 2021-12-16 · ·

The invention provides a crystalline wholly aromatic polyester that is capable of improving slidability and thermal stability at the time of molding, while having heat resistance. The crystalline wholly aromatic polyester is a polycondensate of an aromatic dicarboxylic acid and an aromatic diol, wherein a structural unit derived from the aromatic dicarboxylic acid comprises structural unit (I) of formula (1):

##STR00001##

structural unit (II) of formula (2):

##STR00002##

and structural unit (III) of formula (3):

##STR00003##

and a structural unit derived from the aromatic diol comprises structural unit (IV) of formula (4):

##STR00004##

wherein 30 mol %≤structural unit (I)≤40 mol %; 5 mol %≤structural unit (II)≤10 mol %; 5 mol %≤structural unit (III)≤10 mol %; and 45 mol %≤structural unit (I)+structural unit (II)+structural unit (III)≤50 mol %.

CRYSTALLINE WHOLLY AROMATIC POLYESTER AND POLYESTER RESIN COMPOSITION
20210388156 · 2021-12-16 · ·

The invention provides a crystalline wholly aromatic polyester that is capable of improving slidability and thermal stability at the time of molding, while having heat resistance. The crystalline wholly aromatic polyester is a polycondensate of an aromatic dicarboxylic acid and an aromatic diol, wherein a structural unit derived from the aromatic dicarboxylic acid comprises structural unit (I) of formula (1):

##STR00001##

structural unit (II) of formula (2):

##STR00002##

and structural unit (III) of formula (3):

##STR00003##

and a structural unit derived from the aromatic diol comprises structural unit (IV) of formula (4):

##STR00004##

wherein 30 mol %≤structural unit (I)≤40 mol %; 5 mol %≤structural unit (II)≤10 mol %; 5 mol %≤structural unit (III)≤10 mol %; and 45 mol %≤structural unit (I)+structural unit (II)+structural unit (III)≤50 mol %.

Polyester-Based Sealant Film

Provided is a polyester-based sealant film having highly excellent heat seal strength and excellent recyclability. A polyester-based sealant film of a first aspect of the present invention is a laminated film composed of at least two layers and having a sealing layer and an outermost layer, in which the sealing layer includes a copolymerized polyester formed from a copolymer of terephthalic acid as well as another dicarboxylic acid component and a diol component, the outermost layer includes homopolyethylene terephthalate as a main component, the laminated film has a lamination configuration in which a content proportion (mol %) of the other dicarboxylic acid component in each layer decreases from the sealing layer toward the outermost layer, and a heat seal strength obtainable when the sealing layers of the laminated films are sealed at 0.2 MPa for 1 second in the range of 140° C. to 220° C. is 25 N/15 mm or higher.

BIFURAN POLYESTERS

Semicrystalline bifuran polyesters wherein the diacid and/or diol components include bifuran units such as those derived from 2,2′-bifuran-5,5′-dicarboxylic acid (BFA), dimethyl-2,2′-bifuran-5,5′-dicarboxylate (BFE), and/or bis(hydroxyethyl) bifuranoate (BHEB) Polyethylene-BFE (PEBF) having a high ΔH.sub.f and high T.sub.g determined by DSC on the second heating ramp is described. Polybutylene-BFE (PBBF), polyhexylene-BFE (PHBF), polypropylene-BFE (PPBF), etc., are also described. Method for making bifuran polyesters includes melt esterification or transesterification and polycondensation of one or more monomers comprising a diacid component and a diol component, wherein the one or more monomers include a bifuran monomer, such as BFA, BFE, BHEB or BFD. Also described is a method of forming a bifuran polyester prepolymer in the melt, pelletization, crystallization, and solid state polymerization.