The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

The present disclosure provides a curable resin composition including a thermoset resin, an aliphatic polyketone as a toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature, excellent mechanical properties and low moisture absorption. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

The present disclosure provides a curable resin composition including a thermoset resin, an aliphatic polyketone as a toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature, excellent mechanical properties and low moisture absorption. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

A composition comprising an ethylene/CO interpolymer, formed from a high pressure, free-radical polymerization, and wherein the ethylene/CO interpolymer has the following properties: a) a CO content from “greater than 0” weight percent to less than, or equal to, 10 weight percent CO (carbon monoxide), based on the weight of the interpolymer; and b) a melting point, Tm, in ° C. that meets the following relationship: Tm (° C.)≤601.4*(Density in g/cc)−452.5(° C.).

A composition comprising an ethylene/CO interpolymer, formed from a high pressure, free-radical polymerization, and wherein the ethylene/CO interpolymer has the following properties: a) a CO content from “greater than 0” weight percent to less than, or equal to, 10 weight percent CO (carbon monoxide), based on the weight of the interpolymer; and b) a melting point, Tm, in ° C. that meets the following relationship: Tm (° C.)≤601.4*(Density in g/cc)−452.5(° C.).

A composition comprising an ethylene/CO interpolymer, formed from a high pressure, free-radical polymerization, and wherein the ethylene/CO interpolymer has the following properties: a) a CO content from “greater than 0” weight percent to less than, or equal to, 10 weight percent CO (carbon monoxide), based on the weight of the interpolymer; and b) a melting point, Tm, in ° C. that meets the following relationship: Tm (° C.)≤601.4*(Density in g/cc)−452.5(° C.).

A semicrystalline polyketone powder useful for additive manufacturing may be made by dissolving a polyketone having differential scanning calorimetry (DSC) monomodal melt peak, at a temperature above 50° C. to below the melt temperature of the polyketone, precipitating the dissolved polyketone by cooling, addition of a nonsolvent or combination thereof. The method may be used to form polyketones having a DSC melt peak with an enthalpy greater than the starting polyketone.

A semicrystalline polyketone powder useful for additive manufacturing may be made by dissolving a polyketone having differential scanning calorimetry (DSC) monomodal melt peak, at a temperature above 50° C. to below the melt temperature of the polyketone, precipitating the dissolved polyketone by cooling, addition of a nonsolvent or combination thereof. The method may be used to form polyketones having a DSC melt peak with an enthalpy greater than the starting polyketone.

A molding comprising a matrix from the crosslinking of an aliphatic polyketone with at least one diamine source as crosslinker with formation of imine groups, or a polymer mixture comprising at least one polyketone (PK) and at least one crosslinker, in which the diamine source and the at least one crosslinker are selected from di(aminophenyl) compounds in which the two aminophenyl rings are joined to one another via an aliphatic group which has a carbocyclic radical, diamine compounds selected from compounds of the formulae (I), (II) and (III),

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oligomers/polymers which have at least two amide groups, saturated alicyclic compounds which have at least two primary amine groups and oligomers/polymers which comprise them in incorporated form, and mixtures thereof.