Diphthalonitrile compounds of formula I:

##STR00001##

in free or salt or solvate form, wherein: Ar.sup.1 is a C.sub.6-C.sub.10-aryl group; Ar.sup.2 is a C.sub.6-C.sub.10-aryl group; R.sup.1 and R.sup.2 are independently C.sub.3-C.sub.10-alkyl; T is a C.sub.6-C.sub.10-aryl group; and n is 0, 1, 2, 3, 4 or 5, or a mixture thereof; Cured diphthalonitrile thermosets are provided by curing resin blends of such compounds.

Diphthalonitrile compounds of formula I:

##STR00001##

in free or salt or solvate form, wherein: Ar.sup.1 is a C.sub.6-C.sub.10-aryl group; Ar.sup.2 is a C.sub.6-C.sub.10-aryl group; R.sup.1 and R.sup.2 are independently C.sub.3-C.sub.10-alkyl; T is a C.sub.6-C.sub.10-aryl group; and n is 0, 1, 2, 3, 4 or 5, or a mixture thereof; Cured diphthalonitrile thermosets are provided by curing resin blends of such compounds.

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

The present application relates to a phthalonitrile resin, a polymerizable composition, a prepolymer, a composite, and a preparation method and use thereof. The present application can provide phthalonitrile, and a polymerizable composition and prepolymer using the same, which can have excellent curability, exhibit a suitable processing temperature and a wide window process, and form a composite having excellent physical properties.

The present application relates to a polymerizable composition, a prepolymer, a phthalonitrile resin, a composite, a process for preparing the same, and a use thereof. The present application can provide a polymerizable composition comprising a curing agent which has excellent heat resistance and does not cause defects such as voids that may adversely affect physical properties. In addition, the present application allows for the polymerizable composition to exhibit appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties. The present application can provide a resin having both advantages of a phthalonitrile resin and a polyimide by curing a phthalonitrile compound as a raw material monomer with a curing agent having a polyimide structure.

The present application relates to a polymerizable composition, a prepolymer, a phthalonitrile resin, a composite, a process for preparing the same, and a use thereof. The present application can provide a polymerizable composition comprising a curing agent which has excellent heat resistance and does not cause defects such as voids that may adversely affect physical properties. In addition, the present application allows for the polymerizable composition to exhibit appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties. The present application can provide a resin having both advantages of a phthalonitrile resin and a polyimide by curing a phthalonitrile compound as a raw material monomer with a curing agent having a polyimide structure.

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

The present application relates to a polymerizable composition, a prepolymer, a phthalonitrile resin, a composite, a process for preparing the same, and a use thereof. The present application can provide a polymerizable composition comprising a curing agent which has excellent heat resistance and does not cause defects such as voids that may adversely affect physical properties. In addition, the present application allows for the polymerizable composition to exhibit appropriate curing properties, processing temperatures and process windows and to be capable of forming a composite of excellent physical properties. The present application can provide a resin having both advantages of a phthalonitrile resin and a polyimide by curing a phthalonitrile compound as a raw material monomer with a curing agent having a polyimide structure.