Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

The present invention relates to a phenyl-derivative compound substituted with at least two electron acceptors and at least two electron donors. Formula (I) R.sup.AaR.sup.DbR.sup.ScC.sub.6 wherein a is 2, 3 or 4; b is 2, 3 or 4; c is 0, 1 or 2; a+b−c=6; R.sup.A is at each occurrence independently a group with −M-effect; R.sup.B is at each occurrence independently a group with +−M-effect; R.sup.S is as defined in claim 1. Said compound is suited for use in organic electronic devices, particularly in organic electroluminescent devices.

Provided is, for example, a pattern-forming composition that contains a triazine ring-containing polymer having a predetermined repeating unit structure, represented by formula [4] below, a crosslinking agent, and an organic solvent.

##STR00001##

Compositions and methods for aromatic polysulfone copolymers are described herein. The polysulfone copolymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), improved thermal stability, improved flame resistance, good mechanical properties, chemical resistance and dimensional stability at elevated temperature. The polysulfone copolymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

Provided are a novel polyamide polymer obtained by polymerizing monomers including aromatic diamine substituted with a nitrile group and an amide group and an aromatic dibasic acid compound, a spinning dope comprising the same, and a polyamide molded article. A fiber obtained using the novel polyamide polymer according to the present invention, particularly, a fiber obtained by spinning the polymer according to the present invention may have high strength and high elasticity, such that the fiber may be applied to various industrial fields.

Methods of forming nanoporous materials are described herein that include forming a polymer network with a chemically removable portion. The chemically removable portion may be polycarbonate polymer that is removable on application of heat or exposure to a base, or a polyhexahydrotriazine (PHT) or polyhemiaminal (PHA) polymer that is removable on exposure to an acid. The method generally includes forming a reaction mixture comprising a formaldehyde, a solvent, a primary aromatic diamine, and a diamine having a primary amino group and a secondary amino group, the secondary amino group having a base-reactive substituent, and heating the reaction mixture to a temperature of between about 50 degC and about 150 degC to form a polymer. Removing any portion of the polymer results in formation of nanoscopic pores as polymer chains are decomposed, leaving pores in the polymer matrix.

For example, a triazine ring-containing polymer containing a repeating unit structure represented by Formula (24) below,

##STR00001## wherein R.sup.102 represents a crosslinking group.

The present invention relates to resin compositions, fiber reinforced polymeric structures and electromagnetic induction processes for making same. Such magnetic induction processes are pulsed processes that can be optionally coupled with cooling steps between pulses. The aforementioned fiber reinforced polymeric structures can take forms that include, but are not limited to, pipes; pressure vessels, including rocket motor cases and fire extinguishers; golf club shafts; tennis and badminton racquets; skis; snowboards; hockey sticks; fishing rods; bicycle frames; boat masts; oars; paddles; baseball bats; and softball bats. In addition, such fiber reinforced polymeric structures can be supplemented with other materials, such as a rocket propellant, to form articles, for example, a rocket motor.

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

In an embodiment is provided a polymer that includes a plurality of N-J-N or N—C—S repeating units, wherein each J is independently a carbon atom, an alkyl group, or an aryl group; a plurality of hydrophilic groups bonded with the repeating units; and a plurality of hydrophobic groups bonded with the hydrophilic groups and the repeating units. In another embodiment is provided hydrogels of such polymers. The hydrogels may be used as delivery vehicles for various payloads. In another embodiment is provided methods of forming such polymers.