Cross-linked polymer resins and related salts, solvates, tautomers or stereoisomers are described herein. The cross-linked polymer resins may comprise monomer units of N,N-diallyl aminoalkylphosphonate, a hydrophobic pendant, a tetraallylpiperazinium cross-linker, and sulfur dioxide. A method for producing the cross-linked polymer resins is described. The cross-linked polymer resins may be used as adsorbent materials for the removal of heavy metal ions and contaminant dyes from aqueous solutions. Used cross-linked polymer resins may be removed from solution, cleaned, and reused while maintaining adsorption capacity.

Cross-linked polymer resins and related salts, solvates, tautomers or stereoisomers are described herein. The cross-linked polymer resins may comprise monomer units of N,N-diallyl aminoalkylphosphonate, a hydrophobic pendant, a tetraallylpiperazinium cross-linker, and sulfur dioxide. A method for producing the cross-linked polymer resins is described. The cross-linked polymer resins may be used as adsorbent materials for the removal of heavy metal ions and contaminant dyes from aqueous solutions. Used cross-linked polymer resins may be removed from solution, cleaned, and reused while maintaining adsorption capacity.

Provided are a copolymer of diallylamines and sulfur dioxide having a high molecular weight and a low content amount of impurities such as halogens, and a production method with which it is possible to produce such a copolymer relatively simply and at low cost. This problem is solved by: a copolymer having a weight-average molecular weight of 150,000 or higher obtained by GPC measurement and a degree of polymerization of 1000 or higher, the copolymer being obtained by copolymerizing sulfur dioxide and a sulfonate or alkyl sulfate salt of diallylamines having a specific structure; and a method for producing a copolymer, the method having a step for copolymerizing sulfur dioxide and a sulfonate or alkyl sulfate salt of diallylamines having a specific structure in ethylene glycol or in propylene glycol monomethyl ether.

Provided are a copolymer of diallylamines and sulfur dioxide having a high molecular weight and a low content amount of impurities such as halogens, and a production method with which it is possible to produce such a copolymer relatively simply and at low cost. This problem is solved by: a copolymer having a weight-average molecular weight of 150,000 or higher obtained by GPC measurement and a degree of polymerization of 1000 or higher, the copolymer being obtained by copolymerizing sulfur dioxide and a sulfonate or alkyl sulfate salt of diallylamines having a specific structure; and a method for producing a copolymer, the method having a step for copolymerizing sulfur dioxide and a sulfonate or alkyl sulfate salt of diallylamines having a specific structure in ethylene glycol or in propylene glycol monomethyl ether.

The present invention relates to a method for producing a polybenzazole polymer (P) by reacting a reaction mixture (R.sub.G) comprising at least one aromatic dicarboxylic compound of the general formula (I), at least one aromatic diamino compound of the general formula (IIa), (IIb), (IIc) and/or (IId) and also at least one ionic liquid (IL). The present invention also relates to the polybenzazole polymer (P), which is obtainable by the method according to the invention, and also to the use of the polybenzazole polymer (P), for example as fiber material.

The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallylamine salt having a cationic amine group, such as a diallylammonium halide, or a diallylalkylamine salt having a cationic amine group, such as a diallylalkylammonium salt, or mixtures of the copolymers, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallylamine salt having a cationic amine group comprises a copolymer of diallylammonium chloride and sulfur dioxide and the copolymer of the diallylalkylamine salt having a cationic amine group comprises a copolymer of diallylmonomethylammonium halide, e.g. chloride, and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.

The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallylamine salt having a cationic amine group, such as a diallylammonium halide, or a diallylalkylamine salt having a cationic amine group, such as a diallylalkylammonium salt, or mixtures of the copolymers, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallylamine salt having a cationic amine group comprises a copolymer of diallylammonium chloride and sulfur dioxide and the copolymer of the diallylalkylamine salt having a cationic amine group comprises a copolymer of diallylmonomethylammonium halide, e.g. chloride, and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.

The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallylamine salt having a cationic amine group, such as a diallylammonium halide, or a diallylalkylamine salt having a cationic amine group, such as a diallylalkylammonium salt, or mixtures of the copolymers, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallylamine salt having a cationic amine group comprises a copolymer of diallylammonium chloride and sulfur dioxide and the copolymer of the diallylalkylamine salt having a cationic amine group comprises a copolymer of diallylmonomethylammonium halide, e.g. chloride, and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.

An additive formulation suitable for antistatic modification and improving the electrical conductivity of inanimate organic material, consisting essentially of (A) from 1 to 50% by weight of an olefin-sulfur dioxide copolymer, (B) from 1 to 50% by weight of a compound which comprises one or more basic nitrogen atoms and has at least one relatively long-chain linear or branched hydrocarbon radical having at least four carbon atoms or an equivalent structural element which ensures the solubility of component (B) in the inanimate organic material, (C) from 0.1 to 30% by weight of an oil-soluble acid and (D) from 1 to 80% by weight of a high-boiling organic solvent which consists of one or more molecule types, where at least 80% by weight of these molecule types have a boiling point of more than 150 C. at standard pressure,
where the sum of all components adds up to 100% by weight.

An additive formulation suitable for antistatic modification and improving the electrical conductivity of inanimate organic material, consisting essentially of (A) from 1 to 50% by weight of an olefin-sulfur dioxide copolymer, (B) from 1 to 50% by weight of a compound which comprises one or more basic nitrogen atoms and has at least one relatively long-chain linear or branched hydrocarbon radical having at least four carbon atoms or an equivalent structural element which ensures the solubility of component (B) in the inanimate organic material, (C) from 0.1 to 30% by weight of an oil-soluble acid and (D) from 1 to 80% by weight of a high-boiling organic solvent which consists of one or more molecule types, where at least 80% by weight of these molecule types have a boiling point of more than 150 C. at standard pressure,
where the sum of all components adds up to 100% by weight.