Provided is a polycarbonate-polyorganosiloxane copolymer, which is produced by using a diol monomer (a1) and a polyorganosiloxane (a2) satisfying the following condition, including: a polyorganosiloxane block (A-1) including a specific repeating unit; and a polycarbonate block (A-2) formed of a specific repeating unit: a mixture, which is obtained by bringing the diol monomer (a1), the polyorganosiloxane (a2), a carbonic acid diester, and a basic catalyst present at the same amount ratio as that at a time of production of the polycarbonate-polyorganosiloxane copolymer into contact with each other at from 100° C. to 250° C. for from 0.5 hour to 5 hours, has a haze value of 30 or less measured under conditions of 23° C. and an optical path length of 10 mm in conformity with ISO 14782:1999.

The present disclosure relates to a coating composition, comprising a fluoropolymer component in the form of a fluoropolymer micropowder having a weight average molecular weight of from 300,000 g/mol to 400,000 g/mol, a binder resin, a hydroxy-functional silicone resin; and a silicone oil, as well as articles coated with the composition.

A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

Provided is an endless belt that can be used for fusing a toner image or enhancing the gloss of a toner image, the endless belt including a substrate later and a release layer on the substrate layer. The release layer can include a coating layer that includes an inorganic-organic nanocomposite material in which inorganic nanoparticles are dispersed in a siloxane polymer matrix.

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.