The present application relates to silicone compounds, compositions, packaged products and displays comprising such silicone compounds, and processes for making and using such compositions, packaged products and displays comprising such compositions. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs yet which changes its hydrophilicity/charge when desired.

The present application relates to silicone compounds, compositions, packaged products and displays comprising such silicone compounds, and processes for making and using such compositions, packaged products and displays comprising such compositions. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs yet which changes its hydrophilicity/charge and/or demonstrates cleavage of the functionalized silicone's functionalization when desired.

The present application relates to silicone compounds, compositions, packaged products and displays comprising such silicone compounds, and processes for making and using such compositions, packaged products and displays comprising such compositions. Such compositions have improved deposition and retention properties that may impart improved benefit characteristics to a composition and/or situs yet which changes its hydrophilicity/charge and/or demonstrates cleavage of the functionalized silicone's functionalization when desired.

A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

A hydrophilic silicone, compositions comprising the same, and articles comprising the same are shown and described herein. The hydrophilic silicone is an ionically modified silicone compound wherein the compound has a net neutral charge. The hydrophilic silicone compounds may be provided as part of a composition, e.g., a composition suitable for forming a hydrogel, which may be employed to form a film material and even an article (e.g., in a contact lens).

A hydrophilic silicone, compositions comprising the same, and articles comprising the same are shown and described herein. The hydrophilic silicone is an ionically modified silicone compound wherein the compound has a net neutral charge. The hydrophilic silicone compounds may be provided as part of a composition, e.g., a composition suitable for forming a hydrogel, which may be employed to form a film material and even an article (e.g., in a contact lens).

An adhesion promoter composition is disclosed. The adhesion promoter composition includes a first reactive silane compound and a second reactive silane compound, where the second reactive silane is different from the first. The adhesion promoter composition also includes one or more organic solvents and an organic base. A method for applying the adhesion promoter composition is also disclosed.

An adhesion promoter composition is disclosed. The adhesion promoter composition includes a first reactive silane compound and a second reactive silane compound, where the second reactive silane is different from the first. The adhesion promoter composition also includes one or more organic solvents and an organic base. A method for applying the adhesion promoter composition is also disclosed.

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.

A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.