The present invention relates to a polyorganosiloxane and a moisture and radiation curable adhesive composition comprising the same, in particular, to a polyorganosiloxane and a moisture and radiation curable adhesive composition used in a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

The present invention relates to a polyorganosiloxane and a moisture and radiation curable adhesive composition comprising the same, in particular, to a polyorganosiloxane and a moisture and radiation curable adhesive composition used in a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

A composition includes a silyl hydride (having at least one silicon-bonded hydrogen atom per molecule) and a fluorinated triarylborane Lewis acid. In the method, the Lewis acid catalyzes reaction of silicon bonded hydrogen atoms from the silyl hydride and water, thereby forming a siloxane bond in the resulting product. The composition and method can be used to form siloxane intermediates and cured networks.

A composition includes a silyl hydride (having at least one silicon-bonded hydrogen atom per molecule) and a fluorinated triarylborane Lewis acid. In the method, the Lewis acid catalyzes reaction of silicon bonded hydrogen atoms from the silyl hydride and water, thereby forming a siloxane bond in the resulting product. The composition and method can be used to form siloxane intermediates and cured networks.

A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.

A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.

Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.

Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.

A process for producing a silicone pressure sensitive adhesive is shown and described herein. The process comprises reacting a MQ silicone resin with a polydiorganosiloxane in the absence of a solvent. The MQ silicone resin is a solid, solventless MQ resin. The reaction may be conducted in the presence of a catalyst, a chain extension reagent, or a combination thereof, and the resulting pressure sensitive adhesive can be dissolved in a solvent and the solids content adjusted. The present method provides a manner to provide a cleaner adhesive material that is free of unwanted materials such as aromatic solvents and also substantially free of cyclic siloxane impurities.

An elastomer has the general structure of: ##STR00001##
where: subscript a is 50-500, b is 1-10, c is 2-30, R.sup.1 has the structure:
—CH.sub.2(CH.sub.2).sub.nO(CH.sub.2).sub.pCH(OH)(CH.sub.2).sub.qNR.sup.2R.sup.2′ where n, p and q are each independently 1-5 and R.sup.2 and R.sup.2′ are independently selected from alkyl and hydroxyalkyl groups having 1-5 carbon atoms; where X is a crosslinker remnant bound to a siloxane unit corresponding to subscript c of a siloxane backbone polymer in addition to the one shown so that the crosslinker remnant in each occurrence is a reaction product with two siloxane backbone polymers, wherein the crosslinker is selected from a group consisting of primary organic dienes, divinyl siloxane and polyoxyalkylenes wherein at least two X components correspond to crosslinker remnants connecting the same two siloxane backbone polymers.