Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

Free radically polymerizable synthons for preparing siloxane polyoxamide copolymers are prepared by reacting amine-terminated siloxane polyoxamide compounds with an isocyanate-functional (meth)acrylate, an isocyanate-functional vinyl-substituted aromatic compound, or a vinyl azlactone. These free radically polymerizable synthons can be used to prepare polymer compositions by combining the free radically polymerizable synthons with an initiator and initiating polymerization.

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

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This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

Disclosed are an organic thin film including a semiconducting polymer including a ligand that is metal-coordination bondable or is metal-coordination bonded and an elastomer including a ligand that is metal-coordination bondable or is metal-coordination bonded, wherein the semiconducting polymer and the elastomer are configured to be dynamic intermolecular bonded by a metal-coordination bond, an organic sensor, and an electronic device.

Blend compositions include at least one polydiorganosiloxane polyoxamide copolymer, and at least 70% by weight of at least one silicone tackifying resin. The blend composition is non-tacky at room temperature up to a temperature of at least 100° C. The polydiorganosiloxane polyoxamide copolymer can be a linear or branched copolymer. The blend compositions provide solid, non-powdery, and non-tacky delivery vehicles for silicone tackifying resin.

The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.

The present invention provides a random or block polyimide-siloxane copolymer, which may be prepared from a hard amine monomer, a dianhydride monomer, and a soft amine monomer, may have mechanical properties, flexibility, and thermal properties adjusted through the control of soft amine content, and may exhibits high thermal stability, corrosion resistance, transparency and flexibility, and a method for preparing the same. The random or block polyimide-siloxane copolymer, which may be flexible and thermally stable and may exhibits adjustable mechanical properties and skin-like sensory functions, may be applied to flexible electronic devices.

An aqueous coating composition comprising an aqueous dispersion of polyurethane and a siloxane-based polyamide.

Described are polymerizable high energy light absorbing compounds. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices. Such devices exhibit a number of desirable properties, including providing wearers with favorable optical quality.

Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.