Exemplary methods of forming a silicon-and-carbon-containing material may include flowing a silicon-and-carbon-containing precursor into a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region of the semiconductor processing chamber. The methods may include forming a plasma within the processing region of the silicon-and-carbon-containing precursor. The plasma may be formed at a frequency above 15 MHz. The methods may include depositing a silicon-and-carbon-containing material on the substrate. The silicon-and-carbon-containing material as-deposited may be characterized by a dielectric constant below or about 3.0.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

##STR00001##

as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

##STR00001##

as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one of a hydroxyl and hydrolyzable group, and a perfluoro(poly)ether group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is at least 5, the occurrence order of respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is less than 1.0, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3 is independently a hydrogen atom or a monovalent organic group; and a catalyst.

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one of a hydroxyl and hydrolyzable group, and a perfluoro(poly)ether group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is at least 5, the occurrence order of respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is less than 1.0, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3 is independently a hydrogen atom or a monovalent organic group; and a catalyst.

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one of a hydroxyl and hydrolyzable group, and a perfluoro(poly)ether group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is at least 5, the occurrence order of respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is less than 1.0, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3 is independently a hydrogen atom or a monovalent organic group; and a catalyst.

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one of a hydroxyl and hydrolyzable group, and a perfluoro(poly)ether group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is at least 5, the occurrence order of respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is less than 1.0, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3 is independently a hydrogen atom or a monovalent organic group; and a catalyst.

A moisture curable polyorganosiloxane composition is disclosed. The composition comprises: (A) a polyorganosiloxane endblocked with alkoxysilyl-containing groups at both molecular terminals; (B) a polyorganosiloxane resin having a content of OZ in a range of from about 50 mol % to about 150 mol %, wherein each Z is H or an alkyl group such that OZ represents a silanol group and/or a silicon atom-bonded alkoxy group; and (C) a polyorganosiloxane resin having an alkoxysilyl-containing group. The composition exhibits good to excellent coating performance without using a solvent. In addition, the composition can cure by contacting moisture in air to form a cured product exhibiting good to excellent mechanical properties.