Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

##STR00001##

Silicone polyoxamide and silicone polyoxamide-hydrazide copolymers comprise at least two repeating units of formula (I). In this formula, each R.sup.1 is independently an alkyl, haloalkyl, aralkyl, alkenyl, aryl, or aryl substituted with an alkyl, alkoxy, or halo; each Y is independently an alkylene, aralkylene, or a combination thereof; each G is independently a bond or a divalent residue equal to a diamine of formula R.sup.3HN-G-NHR.sup.3 minus the two —NHR.sup.3 groups; each R.sup.3 is independently hydrogen or alkyl or R.sup.3 taken together with G and with the nitrogen to which they are both attached form a heterocyclic group; each n is independently an integer of 0 to 300; each p is independently an integer of 1 to 25, and the average of p is 1.3 or greater; and each q is independently an integer of 1 to 2, and the average of q is no greater than 1.05.

##STR00001##

A siloxane polymer comprising polysiloxane, silphenylene, isocyanuric acid, and polyether skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the siloxane polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency and light resistance.

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

##STR00001##

This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

Crosslinked aminosiloxanes obtainable by reaction of identical or different aminosiloxanes with identical or different epoxide components which are water-soluble hydrocarbons, the hydrocarbons comprising oxygen as well as carbon, and optionally further elements selected from nitrogen, sulphur and phosphorus, the hydrocarbon having on average more than one terminal epoxy group, the epoxy group being a carbooxirane radical, and, further, not more than 50% of all the amino groups having undergone reaction with an epoxide group.

Crosslinked aminosiloxanes obtainable by reaction of identical or different aminosiloxanes with identical or different epoxide components which are water-soluble hydrocarbons, the hydrocarbons comprising oxygen as well as carbon, and optionally further elements selected from nitrogen, sulphur and phosphorus, the hydrocarbon having on average more than one terminal epoxy group, the epoxy group being a carbooxirane radical, and, further, not more than 50% of all the amino groups having undergone reaction with an epoxide group.

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. (A) Silicone-modified polyimide resin represented by formula (1)
Ee-Ff-Gg  (1)
E is represented by formula (2), F is represented by formula (3), G is a divalent group derived from diamine, f+e+g=100 mol %, the molar ratio f/(e+g) is 0.9-1.1, and e is 1-90 when the sum of e and g is 100. ##STR00001##
R.sup.A is a divalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.
-Im-X-Im-  (3)
Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like. (Bc) Heat-decomposable radical initiator (C) Solvent (D) Antioxidant (E) Fumed silica.

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. (A) Silicone-modified polyimide resin represented by formula (1)
Ee-Ff-Gg  (1)
E is represented by formula (2), F is represented by formula (3), G is a divalent group derived from diamine, f+e+g=100 mol %, the molar ratio f/(e+g) is 0.9-1.1, and e is 1-90 when the sum of e and g is 100. ##STR00001##
R.sup.A is a divalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.
-Im-X-Im-  (3)
Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like. (Bc) Heat-decomposable radical initiator (C) Solvent (D) Antioxidant (E) Fumed silica.

Steel sheet coating compositions in which polymeric resin or ceramic properties are produced by admixing an aluminum coordinate complex and an anhydrous, encapsulated, aluminum particle paste, a polysilazane as a source of silicon, an organic solvent, an organic synthesis catalyst, and optionally a non-metallic, non-ionic, low-nucleophilic base. The admixed coating is applied to sheet steel prior to hot-stamping in order to inhibit surface formation of iron oxides and to improve steel sheet surface characteristics.

Steel sheet coating compositions in which polymeric resin or ceramic properties are produced by admixing an aluminum coordinate complex and an anhydrous, encapsulated, aluminum particle paste, a polysilazane as a source of silicon, an organic solvent, an organic synthesis catalyst, and optionally a non-metallic, non-ionic, low-nucleophilic base. The admixed coating is applied to sheet steel prior to hot-stamping in order to inhibit surface formation of iron oxides and to improve steel sheet surface characteristics.