A polymerizable composition for 3D printing includes a photocurable polymer resin and metal diboride nanosheets. The resulting polymer nanocomposite includes a polymer matrix and metal diboride nanosheets dispersed throughout the polymer matrix. A method of synthesizing a nanomaterial-containing resin for 3D printing includes preparing a dispersion of metal diboride nanosheets in a solvent, and combining the dispersion with a liquid polymer resin to yield the nanomaterial-containing resin. A method of fabricating a nanocomposite structure from the nanomaterial-containing resin includes providing the nanomaterial-containing resin to a three-dimensional printer, forming a three-dimensional structure with the three-dimensional printer, and processing the three-dimensional structure to yield the nanocomposite structure.

A polymerizable composition for 3D printing includes a photocurable polymer resin and metal diboride nanosheets. The resulting polymer nanocomposite includes a polymer matrix and metal diboride nanosheets dispersed throughout the polymer matrix. A method of synthesizing a nanomaterial-containing resin for 3D printing includes preparing a dispersion of metal diboride nanosheets in a solvent, and combining the dispersion with a liquid polymer resin to yield the nanomaterial-containing resin. A method of fabricating a nanocomposite structure from the nanomaterial-containing resin includes providing the nanomaterial-containing resin to a three-dimensional printer, forming a three-dimensional structure with the three-dimensional printer, and processing the three-dimensional structure to yield the nanocomposite structure.

An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.x(R.sup.2R.sup.3SiO.sub.2/2).sub.y(R.sup.3SiO.sub.3/2).sub.z(SiO.sub.4/2).sub.i(BO.sub.(3-k)/2).sub.j(OR.sup.4).sub.k. R.sup.1 is a hydrogen atom or a C2-C6 alkenyl group. R.sup.2 and R.sup.4 are respectively a C1-C6 alkyl group. R.sup.3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ≤3. A sum of x, y, z, and i is 1, and x is larger than 0.

An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.x(R.sup.2R.sup.3SiO.sub.2/2).sub.y(R.sup.3SiO.sub.3/2).sub.z(SiO.sub.4/2).sub.i(BO.sub.(3-k)/2).sub.j(OR.sup.4).sub.k. R.sup.1 is a hydrogen atom or a C2-C6 alkenyl group. R.sup.2 and R.sup.4 are respectively a C1-C6 alkyl group. R.sup.3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ≤3. A sum of x, y, z, and i is 1, and x is larger than 0.

A method of treating a preceramic material includes providing a preceramic polycarbosilane or polycarbosiloxane material that includes a moiety Si—O-M, where Si is silicon, O is oxygen and M is at least one metal that includes at least one transition metal, and thermally converting the preceramic polycarbosilane or polycarbosiloxane that includes the moiety Si—O-M material into a ceramic material.

A method of treating a preceramic material includes providing a preceramic polycarbosilane or polycarbosiloxane material that includes a moiety Si—O-M, where Si is silicon, O is oxygen and M is at least one metal that includes at least one transition metal, and thermally converting the preceramic polycarbosilane or polycarbosiloxane that includes the moiety Si—O-M material into a ceramic material.

A primer is useful for adhering cured silicones to low energy plastic substrates. The primer is prepared from starting materials including a) an organoboron compound capable of forming a free radical generating species, and at least one of b) an organosilicon compound having, per molecule, at least one free radical reactive group and at least one other reactive group, and/or c) an organoborane liberating compound capable of reacting with starting material a) to liberate the free radical generating species. The method for forming the primer may further include use of d) an organic solvent, and e) a free radical polymerizable monomer, oligomer, macromonomer, or polymer.

Provided are a self-welding high dielectric silicone rubber composition and a self-welding high dielectric tape. The self-welding high dielectric silicone rubber composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by an average composition formula (1) and having, in a molecule, at least two alkenyl groups bonded to silicon atoms, R.sup.1.sub.nSiO.sub.(4-n)/2 (1), (in the formula, R.sup.1 represents the same or different, unsubstituted or substituted monovalent hydrocarbon group and n is a positive number of 1.95 to 2.04); (B) 10 to 100 parts by mass of hydrophobic fumed silica having a specific surface area obtained by the BET adsorption method of 50 m.sup.2/g or larger; (C) 100 to 300 parts by mass of a conductive complex oxide; (D) 0.1 to 50 parts by mass of a boric acid or a boric acid compound; (E) 1 to 10 parts by mass of a diorganopolysiloxane capped at both molecular terminals with alkoxy groups; and (F) 0.01 to 10 parts by mass of a curing agent comprising an acyl organic peroxide. The self-welding high dielectric silicone rubber composition can be hot-air vulcanized under normal pressure by extrusion molding or roll forming with calender rolls.

An aspect of the present invention is directed to a vibration damping material for use in a mount part for supporting a motor, the vibration damping material including: a gel of a dehydration condensation reaction product of silicone oil and boric acid, wherein the boric acid is in an amount of 25 to 75 moles based on 100 moles of the total amount of the silicone oil and the boric acid.

The present invention relates to a sol-gel coating composition comprising conductive fillers, intended to make a culinary article compatible with induction.