C08G79/08

Method for preparing polyamide-imide film

One embodiment relates to a method for preparing a polyamide-imide film which is colorless and transparent and has good mechanical properties, easily and efficiently in terms of yield. Particularly, the embodiment relates to a preparation method capable of obtaining a polyamide-imide film of which the optical characteristics, mechanical properties and flexibility are harmoniously improved without complicated processes, by controlling the amount of imide repeating units and amide repeating units constituting the polyamide-imide film.

Polymeric BODIPY dyes and methods for using the same

Polymeric BODIPY dyes including light harvesting BODIPY unit-comprising multichromophores are provided. In some embodiments, the dyes are polymeric tandem dyes that include a light harvesting BODIPY unit-comprising multichromophore and an acceptor chromophore covalently linked to the multichromophore in energy-receiving proximity therewith. The polymeric tandem dyes may be covalently linked to a specific binding member. Also provided are methods of evaluating a sample for the presence of a target analyte and methods of labelling a target molecule using compositions including the polymeric tandem dyes. Kits and systems for practicing the subject methods are also provided.

Polymeric BODIPY dyes and methods for using the same

Polymeric BODIPY dyes including light harvesting BODIPY unit-comprising multichromophores are provided. In some embodiments, the dyes are polymeric tandem dyes that include a light harvesting BODIPY unit-comprising multichromophore and an acceptor chromophore covalently linked to the multichromophore in energy-receiving proximity therewith. The polymeric tandem dyes may be covalently linked to a specific binding member. Also provided are methods of evaluating a sample for the presence of a target analyte and methods of labelling a target molecule using compositions including the polymeric tandem dyes. Kits and systems for practicing the subject methods are also provided.

Adhesive promoter, organic silicon encapsulant composition, and organic silicon encapsulant

An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.x(R.sup.2R.sup.3SiO.sub.2/2).sub.y(R.sup.3SiO.sub.3/2).sub.z(SiO.sub.4/2).sub.i(BO.sub.(3-k)/2).sub.j(OR.sup.4).sub.k. R.sup.1 is a hydrogen atom or a C2-C6 alkenyl group. R.sup.2 and R.sup.4 are respectively a C1-C6 alkyl group. R.sup.3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ≤3. A sum of x, y, z, and i is 1, and x is larger than 0.

Adhesive promoter, organic silicon encapsulant composition, and organic silicon encapsulant

An adhesive promoter, an organic silicon encapsulant composition, and an organic silicon encapsulant are provided. The adhesive promoter used for the organic silicon encapsulant is formed from a borosiloxane polymer represented by a general formula of: (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.x(R.sup.2R.sup.3SiO.sub.2/2).sub.y(R.sup.3SiO.sub.3/2).sub.z(SiO.sub.4/2).sub.i(BO.sub.(3-k)/2).sub.j(OR.sup.4).sub.k. R.sup.1 is a hydrogen atom or a C2-C6 alkenyl group. R.sup.2 and R.sup.4 are respectively a C1-C6 alkyl group. R.sup.3 is a C6-C12 aromatic group. In the general formula, x, y, z, i, j, and k represent a molar ratio. In the general formula, x, y, z, i, and j are a non-negative number smaller than or equal to 1, and k is a positive number ≤3. A sum of x, y, z, and i is 1, and x is larger than 0.

SOLID POLYMER ELECTROLYTE CONTAINING BORON AND FLUORINE STRUCTURES, AND PREPARATION METHOD AND APPLICATION THEREOF
20220328874 · 2022-10-13 ·

The preparation method of the solid polymer electrolyte includes the following steps: S1, adding a vinyl boron fluorine monomer, a vinyl polyether monomer, a modified monomer, and a functional polymer into a solvent, adding an initiator for reaction, and after performing a purification treatment to obtain a polymer system B; S2, adding the polymer system B, a lithium salt, a filler, and an auxiliary agent into a solvent, and adding a crosslinking agent to obtain a mixed solution, and coating the mixed solution on a mold uniformly for reaction; S3, obtaining the solid polymer electrolyte. The obtained solid polymer electrolyte, a positive electrode plate, and a negative electrode plate are assembled into a solid-state battery core, and then a tab welding, a heat treatment, and an encapsulation treatment are performed to obtain a lithium ion battery.

Borate salts, polymers and composites

Described herein are borate salts useful as additives, binders, and electrolyte salts for solid state lithium ion batteries. In particular, the borate salts of Formula (I), Formula (II) and Formula (III) as described herein: ##STR00001##
can be polymerized, or can be bound to an existing polymer, to provide polymeric binders for ceramic solid state electrolytes that are themselves capable of ion transport independent of the ceramic.

Borate salts, polymers and composites

Described herein are borate salts useful as additives, binders, and electrolyte salts for solid state lithium ion batteries. In particular, the borate salts of Formula (I), Formula (II) and Formula (III) as described herein: ##STR00001##
can be polymerized, or can be bound to an existing polymer, to provide polymeric binders for ceramic solid state electrolytes that are themselves capable of ion transport independent of the ceramic.

COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
20230151159 · 2023-05-18 ·

A hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC), the hardmask-forming compound including a moiety represented by Formula 1:

##STR00001##

COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
20230151159 · 2023-05-18 ·

A hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC), the hardmask-forming compound including a moiety represented by Formula 1:

##STR00001##