Manufacturing a low-K dielectric organic/inorganic aerogel composite material and its application are provided. The manufacturing method comprises: (1) mixing; (2) hydrolysis; (3) condensation; (4) aging; (5) drying; (6) impregnating polymer solution; (7) phase separation and drying; and (8) cross-linking and curing. The manufacturing method can produce a low-K dielectric organic/inorganic aerogel composite material having a high strength. The low-K dielectric aerogel is in a porous structure, and its porosity is higher than 70% and its density is from 0.12 g/cm.sup.3 to 0.45 g/cm.sup.3. The dielectric property of the low-K dielectric aerogel decreases along with an increase of its porosity, wherein a dielectric constant thereof is from 1.28 to 1.89, and a dielectric loss thereof is from 0.052 to 0.023. The low-k dielectric aerogel can be used for a dielectric layer in a high-frequency circuit, an insulation layer in a semiconductor device or a microwave circuit in a communication integrated circuit.

Methods of forming a porphene polymeric material are provided. The resulting material can be a porphene or a metalloporphene polymeric material. The structure of the polymer can be selected based on a material provided in the monomer material. Methods of using the polymeric material are also provided.

A polymer is disclosed, represented by Chemical Formula 1 or Chemical Formula 2: ##STR00001## wherein, in Chemical Formula 1 and Chemical Formula 2, Ar.sup.1, Ar.sup.2, R.sup.3, s, x, and y are defined in the detailed description.

A method of making a functionalized fluorinated monomer for use in making oligomers and polymers that can be used to improve surface properties of polymer-derived systems, such as coatings. The method of making a functionalized fluorinated monomer includes reacting at least one fluorinated nucleophilic reactant, such as a fluorinated alcohol, with at least one compound containing at least one epoxide group. Other methods include reaction of a fluorinated alcohol with a cyclic carboxylic anhydride. In another embodiment, a method includes reacting a fluorinated mesylate, tosylate or triflate with an amine, alkoxide or phenoxide. In other embodiments, the method includes reacting a fluorinated alcohol with an alkyl halide, or reacting a fluorinated alkyl halide with an amine. The functionalized fluorinated monomers may be used as intermediates and reacted to modify the functional groups thereon. Further, the functionalized fluorinated monomers may be reacted to form polymers or oligomers, or with polymers or oligomers having functional groups to modify the polymer or oligomer through the functional group thereon.

A method for forming a conjugated heteroaromatic polymer is described, wherein at least one compound of formula (1) is polymerized using an acid as a catalyst, ##STR00001##
wherein X is selected from S, O, Se, Te, PR.sup.2 and NR.sup.2, Y is hydrogen (H) or a precursor of a good leaving group Y.sup.− whose conjugate acid (HY) has a pK.sub.a of less than 30, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HZ) has a pK.sub.a of less than 30, b is 0, 1 or 2, each R.sup.1 is a substituent, and the at least one compound of formula (1) being polymerized includes at least one compound of formula (1) with Z=H and Y≠H.

The invention relates to hydroxybenzophenone-based compounds of formula (I) that are used to improve UV, thermal, and thereto-oxidative stability of high performance aromatic polymers in a blend or as end-cappers of the same polymers.

A process for preparing a low-molecular weight fluoropolyether containing an acid fluoride by decomposing a triflate or trifluoroacetate of a fluoropolyether having a hydroxyl group in the presence of a Lewis acid.

An antibacterial polymer and a preparation method thereof are provided. The antibacterial polymer is obtained by polymerization of a polyol and a guanidine salt, and has the following structure:

##STR00001##

In the preparation method, non-toxic and non-irritating polyols are used as raw materials, wherein the non-toxic and non-irritating polyols are friendly to an environment and a human body.

Embodiments may relate to a microelectronic package comprising: a die and a package substrate coupled to the die with a first interconnect on a first face. The package substrate comprises: a second interconnect and a third interconnect on a second face opposite to the first face; a conductive signal path between the first interconnect and the second interconnect; a conductive ground path between the second interconnect and the third interconnect; and an electrostatic discharge (ESD) protection material coupled to the conductive ground path. The ESD protection material comprises a first electrically-conductive carbon allotrope having a first functional group, a second electrically-conductive carbon allotrope having a second functional group, and an electrically-conductive polymer chemically bonded to the first functional group and the second functional group permitting an electrical signal to pass between the first and second electrically-conductive carbon allotropes.

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.