Patent classifications
C08J2325/02
ADSORBENT RESIN FOR REMOVING PERFLUORINATED POLLUTANTS FROM BODY OF WATER, PREPARATION THEREFOR, AND USE THEREOF
The present invention relates to an adsorbent resin for removing perfluorinated pollutants from a body of water, a preparation therefor and the use thereof. The objective is to solve the problem of traditional adsorbent materials, such as active carbon materials, having a poor effect in terms of removing perfluorooctanoic acid from water, being non-renewable, etc. In the present method, styrene and divinylbenzene are used as framework materials, a suitable pore-forming agent and a suitable dispersant are selected in order to prepare a macroporous resin with a moderate pore size, and an alkylation reaction is carried out at a low hindrance with p-xylylene dichloride (XDC) being used as a post-crosslinking agent, whereby a rigid benzene ring structure is introduced into the resin by means of post-crosslinking, thereby further increasing the hydrophobicity of the resin and increasing the crosslinking degree thereof; in addition, the micropore structure is adjusted in order to obtain an adsorbent resin with a narrow particle size distribution, a uniform pore size and a high specific surface area. The size of micropores in the resin is close to the molecular size of perfluorooctanoates in water, the adsorbate sieving capacity is strong, and the adsorption rate of perfluorinated compounds can be further improved.
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.
##STR00001##
SEPARATION MATERIAL
The present invention provides a separation material comprising porous polymer particles that comprise a styrene-based monomer as a monomer unit; and a coating layer that comprises a macromolecule having hydroxyl groups and covers at least a portion of the surface of the porous polymer particles, wherein the rupture strength is 10 mN or higher.
Antimicrobial And Biological Active Polymer Composites And Related Methods, Materials and Devices
Biologically activated ion-exchange polymer salts are made by exchanging biologically active ionic agents onto ion-exchange polymers. The activated polymers are uniquely surface active and stable to thermal degradation and chemical and other forms of decomposition. The activated ion-exchange polymer salts may be processed and combined with polymer precursors using novel methods and materials to produce stable, biologically activated polymer composites, including antimicrobial and antifouling polymer composites.
Method of treating inflammation
The present invention concerns methods of treating systemic, regional, or local inflammation from a patient suffering or at risk of inflammation comprising administration of a therapeutically effective dose of a sorbent that sorbs an inflammatory mediator in said patient. In some preferred embodiments, the sorbent is a biocompatible organic polymer.
Polymeric surface having reduced biomolecule adhesion to thermoplastic articles of such substrate
A substrate is described having a treated contact surface comprising a carbon or silicon compound comprising from 1 to 30 atomic percent oxygen, from 0.1 to 30 atomic percent nitrogen, or both, each as measured by XPS. The treated contact surface has a biomolecule recovery percentage greater than the biomolecule recovery percentage of the surface before treatment according to the method.
POLYMERIC SURFACE HAVING REDUCED BIOMOLECULE ADHESION TO THERMOPLASTIC ARTICLES OF SUCH SUBSTRATE
A substrate is described having a treated contact surface comprising a carbon or silicon compound comprising from 1 to 30 atomic percent oxygen, from 0.1 to 30 atomic percent nitrogen, or both, each as measured by XPS. The treated contact surface has a biomolecule recovery percentage greater than the biomolecule recovery percentage of the surface before treatment according to the method.
Expandable compositions containing aromatic vinyl polymers having self-extinguishing properties and improved processability
The present invention relates to an expandable polymeric composition comprising: a) a polymeric matrix containing vinyl aromatic polymers and/or copolymers; b) from 0.1% to 20% by weight, calculated on the polymeric matrix (a), of an athermanous agent; c) from 0.01% to 10% by weight, calculated on the polymeric matrix (a), of at least one non-polymeric brominated flame retardant additive; d) from 0.01% to 10% by weight, calculated on the polymeric matrix (a), of at least one brominated polymer containing at least 50% bromine; e) from 0.01% to 5% by weight, calculated on the polymeric matrix (a), of a synergistic flame retardant additive; f) from 1% by weight to 10% by weight of at least one blowing agent.
Resin composition and article made therefrom
The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.
PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Manufacturing method includes forming photoresist layer including photoresist composition over substrate. Photoresist composition includes: photoactive compound, polymer, crosslinker. The polymer structure
##STR00001##
A1, A2, A3 independently C1-C30 aryl, alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl, acetyl, acetylalkyl, carboxyl, alkyl carboxyl, cycloalkyl carboxyl, hydrocarbon ring, heterocyclic, chain, ring, 3-D structure; R1 is C4-C15 chain, cyclic, 3-D structure alkyl, cycloalkyl, hydroxylalkyl, alkoxy, or alkoxyl alkyl; proportion of x, y, and z in polymer is 0≤x/(x+y+z)≤1, 0≤y/(x+y+z)≤1, and 0≤z/(x+y+z)≤1, x, y, and z all not 0 for same polymer. Crosslinker is monomer, oligomer, polymer including structures
##STR00002##
B1, B2, B3, B4, and D each independently C1-C30 aryl, alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl, acetyl, acetylalkyl, carboxyl, alkyl carboxyl, cycloalkyl carboxyl, hydrocarbon ring, heterocyclic group, chain, ring, 3-D structure; R2 and Ra are C4-C15 chain, cyclic, 3-D structure alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl.