Provided herein is a dual cure resin useful for the production of objects by stereolithography, said resin comprising a mixture of: (a) a light-polymerizable component; and (b) a heat-polymerizable component, said heat-polymerizable component comprising: (i) a dicyclopentadiene-containing polyepoxide resin; (ii) a cyanate ester resin; (iii) an epoxy-reactive toughening agent; and (iv) a core shell rubber toughener.

The present invention relates to a resin composition for forming an optical film, an optical film, and a polarizing plate, in which the resin composition for forming an optical film improves adhesion between an antiglare layer and a light-transmitting substrate film and enables the antiglare layer and the optical film to exhibit excellent optical properties such as appropriate haze, low gloss value, and excellent antiglare properties. The composition for forming an optical film is a resin composition for forming an optical film for forming an infiltration layer and an antiglare layer having surface irregularities on a light-transmitting substrate film, and comprises: a binder-forming compound including a polyfunctional (meth)acrylate-based compound having three or more functionalities, and a permeable compound having a hydrophilic functional group and a photo-curable functional group; two or more light-transmitting fine particles having a sub-micron (sub-μm) scale; and a permeable solvent capable of dissolving at least a part of the light-transmitting substrate film, wherein the binder-forming compound and the permeable solvent have a weight ratio of 1:0.04 or more.

A porous resin film for a metal layer laminate board and a metal layer laminate board are provided to suppress damage to a metal layer disposed on an inner peripheral surface of a through hole and to have excellent electrical connection reliability even under the high temperature environment. The porous resin film for a metal layer laminate board is used in lamination of a metal layer. The porous resin film for a metal layer laminate board has a minimum thermal expansion coefficient X in a plane direction perpendicular to a thickness direction and a thermal expansion coefficient Z in the thickness direction. In the porous resin film for a metal layer laminate board, a ratio (Z/X) of the thermal expansion coefficient Z in the thickness direction to the minimum thermal expansion coefficient X is 3.5 or less.

Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1):

##STR00001##

where R.sup.1s each independently represent a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2s each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1a), and at least one thereof represents a vinyl group-containing aromatic group, “n” represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

The present disclosure relates to a composition that includes a first layer that includes a polymer having a repeat unit with a structure that includes

##STR00001##

where m is between 2 and 100, inclusively, the repeat unit is protonated at at least one of position A) and/or B) and/or sulfonated at at least one of rings 1) and/or 2), R.sub.1 includes at least one of a lone pair of electrons, a covalent bond, hydrogen, and/or a hydrocarbon functional group, R.sub.2 includes at least one of a lone pair of electrons, a covalent bond, hydrogen, and/or a hydrocarbon functional group, and is a covalent bond.

A method for manufacturing a crosslinked polyolefin separator and the crosslinked polyolefin separator obtained therefrom are provided. The method includes non-grafted polyolefin having a weight average molecular weight of 300,000 or more and silane-grafted polyolefin having a weight average molecular weight of 300,000 or more. The method minimizes gel formation, a side reaction occurring in an extruder during the manufacture of the separator, and provides the separator having a uniform surface.

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

A footwear article is provided. The footwear article includes a shoe sole. The shoe sole includes a crosslinked foam polyolefin elastomer having a density less than 0.88 g/cm.sup.3, the crosslinked foam polyolefin elastomer including: a silane-grafted polyolefin elastomer, a silane-grafted olefin block copolymer, a polyolefin elastomer (POE), an olefin block copolymer (OBC), or a combination thereof; an ethylene vinyl acetate (EVA) copolymer; a crosslinker; a condensation catalyst; and a foaming agent. The shoe sole exhibits a compression set of from about 1.0% to about 50.0%, as measured according to ASTM D 395 (48 hrs @ 50° C.).

Hydrogels, bioplastics, and techniques for generating the same are described herein. An example method includes generating a resin including a globular protein, a co-monomer, water, and a photoinitiator. A hydrogel is generated by exposing the resin to light, thereby polymerizing the globular protein and the co-monomer. Further, the example method includes dehydrating the hydrogel by removing at least a portion of the water; and rehydrating the hydrogel in the presence of a hydrogen bonding agent.

The present invention relates to a hard coating film, and, more particularly, to a hard coating film having hardness and excellent physical properties without a supporting substrate. According to the present invention, the hard coating film has high physical properties including hardness, scratch resistance, transparency, durability, light resistance, and light transmittance. Thus, the hard coating film can find useful applications in various fields thanks to its excellent physical properties.