Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

A thermoset resin composition and composite materials containing reinforcement fibers impregnated with the thermoset resin composition. The thermoset resin composition contains: (a) a combination of multifunctional epoxy resins; (b) 4,4-meth-ylenebis(2,6-xylidine) as a curative for the epoxy resins; and (c) a thermoplastic component, wherein the thermoset resin composition is void of any catalyst or accelerator that is reactive with the epoxy resins.

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. It provides an epoxy resin composition that includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets the undermentioned conditions (a) to (d): (a) it contains an isocyanurate type epoxy resin [A1] as component [A] in an amount of 10 to 40 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (b) it contains a bisphenol type epoxy resin [A2] as a component [A] in an amount of 40 to 90 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (c) resin [A2] has an average epoxy equivalent weight of 220 to 500 g/eq, and (d) the content of component [B] is such that the ratio of the number of imidazole groups to the total number of epoxy groups in the epoxy resins is 0.01 to 0.06.

Methods for making and curing resin-based adhesives are disclosed using encapsulated amine accelerators activated by providing ultrasonic energy.

Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.

Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.