A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

The present invention relates to a molding made of expanded bead foam, wherein at least one fiber (F) is partly within the molding, i.e. is surrounded by the expanded bead foam. The two ends of the respective fibers (F) that are not surrounded by the expanded bead foam thus each project from one side of the corresponding molding. The present invention further provides a panel comprising at least one such molding and at least one further layer (S1). The present invention further provides processes for producing the moldings of the invention from expanded bead foam or the panels of the invention and for the use thereof, for example as rotor blade in wind turbines.

The present disclosure relates to composites, systems, and methods for making the same. In particular, the present disclosure relates to composites that are useful for thermal protection applications, and systems and methods for making the same.

A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C═C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

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A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

A curable composition includes an olefin-aromatic vinyl compound-aromatic polyene copolymer satisfying conditions (1) to (4) and an additive resin, which is at least one of a hydrocarbon-based elastomer, polyphenylene ether, olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer, and aromatic polyene-based resin. (1) The number average molecular weight of the copolymer is 5000 to 100000. (2) The aromatic vinyl compound monomer has 8 to 20 carbon atoms, and the content of the unit of the monomer is 0 to 70 mass %. (3) The aromatic polyene is selected from polyenes having 5 to 20 carbon atoms and a plurality of vinyl and/or vinylene groups in the molecule, and the content of the groups is 1.5 to 20 pieces per number average molecular weight. (4) The olefin is selected from olefins having 2 to 20 carbon atoms, and the total monomer units of the olefin, aromatic vinyl compound, and aromatic polyene is 100 mass %.

This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C.sub.6-C.sub.20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.

An object of the present disclosure is to provide a composite material laminate excellent in impact resistance and vibration damping property. The present disclosure is a composite material laminate including a metal substrate, an adhesive layer formed on a surface of the metal substrate, and a foamed body layer formed on a surface of the adhesive layer, wherein a shear fracture strength (S) at an interface between the metal substrate and the adhesive layer is 1.0 MPa or more, and (S/F) determined by dividing the shear fracture strength (S) at the interface by a bending elastic modulus (F) of the foamed body layer is 0.007 or more and 0.5 or less.

Disclosed is a composition including at least one polymer, wherein the polymer is in the form of a powder, and wherein the polymer includes at least one thermoplastic polymer. The thermoplastic polymer is selected from at least one polyaryletherketone and/or a copolymer and/or a block-copolymer and/or a polymer blend thereof, wherein the composition has a melt volume rate (MVR) of at least 5 cm.sup.3/10 min and a process of manufacturing and a use thereof. Also disclosed are a process for the manufacture of a construction element and the construction element thereof.

An aspect of the present invention is a resin composition, which contains a polyphenylene ether compound, a curing agent, boron nitride, and an inorganic filler other than the boron nitride, in which the content of boron nitride is 15 to 70 parts by volume with respect to 100 parts by volume of the sum of the polyphenylene ether compound and the curing agent.