A continuous process for the recycling of aramid fiber comprising the following steps: combining aramid fibrous material including non-continuous aramid fibers with sulfuric acid to obtain a spin dope comprising aramid, and processing the spin dope including aramid into a continuous aramid fiber. The invention also pertains to a continuous aramid fiber, preferably obtainable by said process, and to a multifilament yarn including the continuous aramid fiber.

The embodiments relate to a polyamide-based film that is excellent in optical properties and mechanical properties, to a process for preparing the same, and to a cover window and a display device comprising the same. It comprises a polyamide-based polymer and a filler in an amount of 600 ppm or more relative to the weight of the polyamide-based polymer, wherein when the 3D surface roughness thereof is measured, the number of summits per unit area (Sds) is 4,400/mm.sup.2 or less.

The embodiments provide a polyamide-based film, which comprises a polyamide-based polymer and has an RSR.sub.A value of 3.4 m/N to 5.0 m/N as represented by the following Equation 1 based on the thickness of the film of 50 μm, and which is excellent in loop stiffness, static flexural characteristics, and folding characteristics while securing mechanical and optical properties at least a certain level, a process for preparing the same, and a cover window and a display device comprising the same. <Equation 1> RSR.sub.A=(RSR.sub.MD+RSR.sub.TD)/2 In Equation 1, RSR.sub.MD is the loop stiffness value measured with the MD direction of the film as the longitudinal direction at room temperature, and RSR.sub.TD is the loop stiffness value measured with the TD direction of the film as the longitudinal direction at room temperature.

The present invention relates to a thermoplastic resin composition and a molded article manufactured using the same. The present invention has an effect of providing a thermoplastic resin composition that has significantly improved tensile strength, is lightweight, and is suitable for replacing metal parts while maintaining impact strength, elongation, and processability equal or superior to those of a conventional polyamide composite material and a molded article manufactured using the thermoplastic resin composition.

A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

The present invention relates to a diamine, and a polymer and film produced using the same. Specifically, the diamine may be significantly effectively used as a monomer for producing a polyimide-based film that is colorless and transparent and has improved mechanical strength.

A separator for a non-aqueous secondary battery contains: a porous layer that is provided on only one side of the porous substrate, and that contains a resin having at least one bonding group selected from an amide bond, an imide bond, and a sulfonyl bond, in which, in the porous substrate, an absolute value of a difference between a temperature of an endothermic peak observed at 120° C. to 145° C. in a temperature raising process 1, and a temperature of an endothermic peak observed at 120° C. to 145° C. in a temperature raising process 2, is 1.50° C. or higher in DSC measurement when the temperature raising process 1 of continuously raising the temperature from 30° C. to 200° C. at a temperature change rate of 5° C./min in a nitrogen atmosphere, and the temperature raising process 2 of lowering the temperature from 200° C. to 30° C. and raising the temperature from 30° C. to 200° C., are performed.

A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 μm and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1−Tmf2)≥3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1−Cd2)≥3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C×1>C×2 and (C×1−C×2)≥3 percent.