A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

The present specification provides a composition comprising a material of Chemical Formula 1: ##STR00001##
having a molecular weight of 500,000 to 700,000 where R1 and R2 are the same as or different from each other, and each independently is hydrogen, deuterium, or an alkyl group, and n is from 10,000 to 20,000, for forming a reverse osmosis membrane protective layer, a method for preparing a reverse osmosis membrane using the same, a reverse osmosis membrane and a water-treatment module.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

A foamed polymer composition includes a matrix polymer component, and from 0.01 wt % to 2 wt %, based on the weight of the polymer composition, of a nanostructured fluoropolymer, a nanostructured fluoropolymer encapsulated by an encapsulating polymer, or a combination thereof. The matrix polymer component includes polybutylene terephthalate (PBT), polyetherimide (PEI), polyethylene terephthalate (PET), polycarbonate (PC), poly(p-phenylene oxide) (PPO), polystyrene (PS), polyphenylene sulfide (PPS), polypropylene (PP), polyamide (PA), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), copolymers thereof, or a combination thereof. Methods for forming foamed polymer compositions, including core-back molding methods and extrusion foaming methods, are also described.

Provided is a method for producing a material that suppresses a decrease in the life of an insulation against surge voltage, that is, a material that provides a long dielectric breakdown lifetime. The method is a method for producing a fullerene-derivative-containing resin composition containing a fullerene derivative and a resin that has an affinity for a polar solvent, including: a step (I) of dispersing a fullerene derivative in a polar solvent; and a step (II) of mixing the polar solvent in which the fullerene derivative is dispersed with a resin that has an affinity for the polar solvent.

The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.

A protective window includes a flexible base film and a hard coating layer disposed on the flexible base film. The hard coating layer includes a silicone leveling agent and an inorganic antistatic agent. The coating layer includes an upper area and a lower area disposed between the upper area and the flexible base film, and a density of the inorganic antistatic agent in the lower area is greater than a density of the inorganic antistatic agent in the upper area.

A conductive paste composition according to the present disclosure contains silver-coated copper nanowires with a core-shell structure; a binder mixture containing a silicone resin binder and a hydrocarbon-based resin binder; and an organic solvent, such that the conductive paste composition has a low sheet resistance and may withstand a high temperature, thereby implementing excellent conductivity and electromagnetic wave shielding properties. Furthermore, the conductive paste may be widely used in various fields such as electromagnetic wave shielding, solar cell electrodes, electronic circuits.