The process disclosed includes an extruder under extrusion conditions at a temperature from 50° C. to 250° C., and a polymer composition. The polymer composition includes (A) greater than or equal to 5 wt % of a silane functionalized olefin-based polymer with first melting temperature, Tm1, (B) optionally, a nonsilane functionalized polyolefin, with second melting temperature, Tm2, (C) a highly effective silanol condensation catalyst (HEC), (D) a permeability modifier, and (E) optionally, a scorch inhibitor. The process includes introducing a physical blowing agent into the polymer composition to form a foamable composition. The foamable composition is cooled to a foaming temperature from 10° C. less than to 10° C. greater than Tm1. The foamable composition from an extruder exit die to form a foam composition. The foam composition is moisture cured to form a crosslinked foam composition having a density from 0.010 g/cc to 0.200 g/cc, and a gel content from 5% to 100%.

An object of the present invention is to provide a resin composition for an odor-adsorbing molded article that is excellent in manufacturability, eliminates odor by exerting a high adsorbing effect on odorous organic matter originally contained in packaging materials and odor generated by the decomposition, etc. of resins constituting packages during disinfection/sterilization treatment such as UV irradiation, hot packing, boiling, γ ray irradiation, or EB irradiation, is less likely to desorb the odor once adsorbed and capable of efficiently adsorbing odor and therefore exerts a high adsorbing effect over a long period without reducing the ability to adsorb odor, and is excellent in resistance to change in taste and odor of contents, and an odor-adsorbing molded article prepared from the resin composition for an odor-adsorbing molded article. The present invention provides a resin composition for an odor-adsorbing molded article comprising at least thermoplastic resin A and an odor adsorbent material, wherein the odor adsorbent material comprises hydrophobic zeolite having a SiO.sub.2/Al.sub.2O.sub.3 molar ratio of 30/1 to 8000/1, and a melt flow rate of the thermoplastic resin A is 5 g/min or more and 100 g/min or less, and an odor-adsorbing molded article prepared from the resin composition for an odor-adsorbing molded article.

Compositions for removing contaminants from plastics processing equipment are described herein. The compositions may include a polymeric carrier component, an oxidizing agent, an abrasive and/or a gas agent. Methods of preparing the compositions described herein and methods of removing contaminants from plastics processing equipment are also described.

Disclosed herein are polymerization processes where recycled polymeric material is fed to polymerization process to produce a blend of virgin polymer with recycled polymeric content.

The invention provides a thermoplastic resin composition, a molded article, and production methods therefor. The thermoplastic resin composition can sufficiently exhibit a cellulose addition effect and impart excellent mechanical strength to the molded article, particularly a foam molded article. More specifically, the invention provides a resin composition and a foam molded article thereof. The resin composition contains: a cellulose fiber (A); an amorphous resin (B) having a glass transition temperature of 160° C. or lower; a crystalline resin (C) having a melting point (melting peak temperature) of 80° C. to 150° C. and a melting start temperature lower than the melting point by 30° C. or more; and a thermoplastic resin (D) having a melting point or a glass transition temperature higher than the melting point of the crystalline resin (C) by 5° C. or more.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A porous polymer composite for daytime radiative cooling includes a porous polymer matrix comprising a thermoplastic polymer and including a plurality of pores, and selectively emitting particles dispersed in the porous polymer matrix. When exposed to solar radiation, the porous polymer composite comprises an infrared emissivity of at least about 80% in a wavelength range of 8-13 μm and/or a solar reflectivity of at least about 80% in a wavelength range of 0.3-2 μm.

A blend suitable for use in a release layer of a multilayer protective film. The blends comprise greater than 50 wt. % of an ethylene/alpha-olefin copolymer, a functionalized ethylene-based polymer, and an inorganic filler.

The invention relates to the technical field of composites, in particular to a high-toughness and high-strength wood-plastic composite and a preparation method thereof. The wood-plastic composite is prepared from the following preparation raw materials in parts by mass: 30-50 parts of wood flour, 11-20 parts of high molecular weight polyethylene, 30-52 parts of polypropylene and 2-10 parts of an interface modifier. Polypropylene is used as a main component of a plastic matrix; high molecular weight polyethylene is used as a secondary component of the plastic matrix and has a toughening effect; wood flour is used as a filler to improve the strength of the wood-plastic composite; the interface modifier can improve the interface bonding between the wood flour and the plastic matrix, and all components have a synergistic effect, so that the obtained wood-plastic composite has high toughness and high strength.

A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.