Patent classifications
C08J2423/10
Ethylene interpolymer products and films
This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless Long Chain Branching Factor, LCBF, greater than or equal to 0.001; a residual catalytic metal of from ≥0.03 to ≤5 ppm of hafnium, and; a dimensionless unsaturation ratio, UR, of from ≥−0.40 to ≤0.06, wherein UR is defined by the following relationship; UR=(SC.sup.U−T.sup.U)/T.sup.U, where SC.sup.U is the amount of a side chain unsaturation per 100 carbons and T.sup.U is amount of a terminal unsaturation per 100 carbons, in said ethylene interpolymer product. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity (M.sub.w/M.sub.n) from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI.sub.50) from about 1% to about 98%.
Plastic Films
The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).
Process for the production of an additive for bituminous conglomerates with high mechanical performances
The present invention refers to a process for the production of an additive composition intended to be mixed into a bituminous conglomerate for road paving. The process includes grinding a mixed waste material containing a mixture of plastic materials, which includes at least one plastic material based on a polyolefin thermoplastic material, washing the ground mixed waste material and separating a portion of low-density material which contains the plastic material based on a polyolefin thermoplastic polymer from the mixed waste material. This portion of low-density material is then ground to a particle size between 10 mm and 20 mm; and then mixed with a material based on polyvinyl butyral. The resultant mixture is further ground to produce an additive composition having a particle size between 4 mm and 6 mm.
Ethylene interpolymer products and films
This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless nonlinear rheology network parameter, Δ.sub.int., greater than or equal to 0.01, satisfying 0.01×(Z−50).sup.0.78≤Δ.sub.int.≤0.01×(Z−60).sup.0.78 inequality wherein Z is a normalized molecular weight defined by
where M.sub.w and M.sub.e are the weight average and entanglement molecular weights, and; a residual catalytic metal of from ≥0.03 to ≤5 ppm of hafnium. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity,
from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI.sub.50) from about 1% to about 98%.
Resin composition, masterbatch pellets, and molded resin composition product and method for producing the same
Provided are a resin composition and masterbatch pellets, which enable a molded resin composition product to improve both flexural modulus and Izod impact strength, and a molded resin composition product having both improved flexural modulus and improved Izod impact strength, and a method for producing the same. The resin composition includes 45 to 95 mass % of an olefin polymer, 1 to 50 mass % of fibrous basic magnesium sulfate, 0.00001 to 0.8 mass % of spherical silica particles, and 0.1 to 10 mass % of a lubricant. Also, the masterbatch pellets are for production of the resin composition by kneading the masterbatch pellets with a diluent containing olefin polymer, and the masterbatch pellets contain 10 to 50 mass % of an olefin polymer, 35 to 80 mass % of fibrous basic magnesium sulfate, 0.00005 to 5.0 mass % of spherical silica particles, and 0.5 to 10 mass % of a lubricant.
Molding compositions and foam molded articles made thereof
A foamed article formed by foam injection molding or foam extrusion of a composition is disclosed. The article is formed from a molding composition consisting essentially of: 100 phr of at least two different hydrogenated styrenic block copolymers (HSBC), a first HSBC and a second HSBC, having different molecular weights, a molecular weight ratio of at least 1.2:1, respectively; and a weight ratio of ranging from 5:95 to 95:5, respectively; 10-55 phr of a polypropylene having a melt flow of at least 2 g10/min; and optionally up to 55 phr of a plasticizer, selected from hydrocarbon based oils, fatty acids, triglyceride oils, and mixtures thereof. The composition has a melt flow rate of 2-50 g/10 min, a Shore A hardness of 60-90, a melt strength (F) of at least 0.010 N, and a melt strength (V) of at least 10.
Thin Single-Site Catalyzed Polymer Sheets
Thin polymer sheets and used thereof are described. A polymer sheet can include greater than 90 wt. % of a single-site catalyzed polyolefin (PO) and have a thickness of at least 0.0254 cm. The sheet can be used to produce molded articles.
Thermoplastic composition
An extrusion composition containing at least one resin selected from the group consisting of polypropylene homopolymers, polypropylene random copolymers, and polypropylene impact copolymers. The extrusion composition also contains at least one benzoic acid salt-based nucleating agent provided in the composition at a use level of between about 0.01 and 0.15 parts by weight, in relation to 100 parts by weight of the resin and at least one co-additive selected from the group consisting of poly(ethylene glycol) and copolymers containing segments of ethylene oxide, wherein the co-additive has a number average molecular weight of about 300 or more, and wherein the use level of the co-additive is about 0.005 parts by weight or more, in relation to 100 parts by weight of the resin.
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE
A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.
Foam compositions and uses thereof
Components for articles of footwear and athletic equipment are provided including a foam. A variety of foams and foam components and compositions for forming the foams are provided. In some aspects, the foams and components including the foams can have exceptionally high energy return while also having improved durability and softness. In particular, midsoles including the foams are provided for use in an article of footwear. Methods of making the compositions and foams are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding or injection molding followed by compression molding.