A coated substrate that comprises a polyolefin substrate having a functional polymer layer disposed thereon. The polyolefin substrate has a flow through pore structure with a pore size ranging from about 5 microns to about 250 microns. The functional polymer layer has a thickness ranging from about 1 micron to about 20 microns and a layer pore structure having a pore size ranging from about 1 nm to about 100 nm.

Disclosed are a copolymer, porous membranes made from the copolymer, and a method of treating fluids using the porous membranes to remove metal ions, for example, from fluids originating in the microelectronics industry, wherein the copolymer includes polymerized monomeric units I and II, wherein monomeric unit I is of the formula A-XCH.sub.2B, wherein A is Rf(CH.sub.2)n, Rf is a perfluoro alkyl group of the formula CF.sub.3(CF.sub.2).sub.x, wherein x is 3-12, n is 1-6, X is O or S, and B is vinylphenyl, the monomeric unit II is haloalkyl styrene, and optionally wherein the halo group of haloalkyl is replaced with an optional substituent, for example, ethylenediamine tetra acetic acid, iminodiacetic acid, or iminodisuccinic acid.

A thermal insulating additive, product formed therefrom, and method of making the same, wherein the thermal insulating additive comprises a plurality of hollow polymeric particles having an average particle size up to about 0.3 micrometers. The hollow polymeric particles exhibit a mechanical strength in a compression test up to about 420 psi and a thermal conductivity that is less than 0.150 W/m-k. The hollow polymeric particles are individually formed as an alkaline swellable core that is at least partially encapsulated with two or more shell layers; the alkaline swellable core prior to swelling exhibits an average particle size that is less than about 50 nanometers.

A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion. ##STR00001##

The present invention relates to a curable resin composition comprising a polyol (A) having an average hydroxyl value of 200 to 1500 mg KOH/g, a polyisocyanate (B), and polymer fine particles (C), and a curable resin composition comprising a polyol (A), a polyisocyanate (B), and polymer fine particles (C), wherein the polyol (A) comprises a polyester polyol (a2) as an essential component, and the amount of the polyester polyol (a2) is not less than 20 parts by mass per 100 parts by mass of the polyol (A).

An object of the present invention is to provide a polyolefin-based film that is excellent in withstand voltage characteristics and reliability in high-temperature environments and is suitable for use in, for example, capacitors to be used at high temperatures and high voltages, and a main object is to provide a polyolefin-based film that includes a layer A including a cycloolefin-based resin and a polypropylene-based resin and has a total light transmittance of 85% or more and an internal haze of 4.0% or less.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

A foam includes a cellular structure and having a density of at most 0.50 g/cm.sup.3, where the cellular structure is provided by a solid material that includes humins. Such a foam is prepared in a process, which includes: providing a starting material containing humins; and heating the starting material to a temperature in the range of 150 to 450 C. The foam can be used in articles for a variety of applications such as substrate for plant growth, as adsorbent for treating waste water or waste gases, as support for solid catalysts, as insulation material, or packaging material.

The present invention relates to a curable resin composition comprising a polyol (A) having an average hydroxyl value of 200 to 1500 mg KOH/g, a polyisocyanate (B), and polymer fine particles (C), and a curable resin composition comprising a polyol (A), a polyisocyanate (B), and polymer fine particles (C), wherein the polyol (A) comprises a polyester polyol (a2) as an essential component, and the amount of the polyester polyol (a2) is not less than 20 parts by mass per 100 parts by mass of the polyol (A).

A method of making an ion exchange foam is described. The method includes forming an aqueous phase by suspending an ion exchange resin in an aqueous solvent. An organic phase is formed by mixing at least a divinylbenzene, a monomer, and a surfactant. The formed aqueous phase is mixed with the formed organic phase to form an emulsion. The emulsion is polymerized to form the ion exchange foam. The ion exchange foam can be used with a plurality of sample vials in an autosampler.