A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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Biologically activated ion-exchange polymer salts are made by exchanging biologically active ionic agents onto ion-exchange polymers. The activated polymers are uniquely surface active and stable to thermal degradation and chemical and other forms of decomposition. The activated ion-exchange polymer salts may be processed and combined with polymer precursors using novel methods and materials to produce stable, biologically activated polymer composites, including antimicrobial and antifouling polymer composites.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

A thermal insulating additive, product formed therefrom, and method of making the same, wherein the thermal insulating additive comprises a plurality of hollow polymeric particles having an average particle size up to about 0.3 micrometers. The hollow polymeric particles exhibit a mechanical strength in a compression test up to about 420 psi and a thermal conductivity that is less than 0.150 W/m-k. The hollow polymeric particles are individually formed as an alkaline swellable core that is at least partially encapsulated with two or more shell layers; the alkaline swellable core prior to swelling exhibits an average particle size that is less than about 50 nanometers.

A coated substrate that comprises a polyolefin substrate having a functional polymer layer disposed thereon. The polyolefin substrate has a flow through pore structure with a pore size ranging from about 5 microns to about 250 microns. The functional polymer layer has a thickness ranging from about 1 micron to about 20 microns and a layer pore structure having a pore size ranging from about 1 nm to about 100 nm.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): ##STR00001## in formula (I), t is an integer ranging from 2 to 6,
wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

A foam includes a cellular structure and having a density of at most 0.50 g/cm.sup.3, where the cellular structure is provided by a solid material that includes humins. Such a foam is prepared in a process, which includes: providing a starting material containing humins; and heating the starting material to a temperature in the range of 150 to 450 C. The foam can be used in articles for a variety of applications such as substrate for plant growth, as adsorbent for treating waste water or waste gases, as support for solid catalysts, as insulation material, or packaging material.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I):

##STR00001## in formula (I), t is an integer ranging from 1 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

The present invention relates to a curable resin composition comprising a polyol (A) having an average hydroxyl value of 200 to 1500 mg KOH/g, a polyisocyanate (B), and polymer fine particles (C), and a curable resin composition comprising a polyol (A), a polyisocyanate (B), and polymer fine particles (C), wherein the polyol (A) comprises a polyester polyol (a2) as an essential component, and the amount of the polyester polyol (a2) is not less than 20 parts by mass per 100 parts by mass of the polyol (A).