A foamed polymer composition includes a matrix polymer component, and from 0.01 wt % to 2 wt %, based on the weight of the polymer composition, of a nanostructured fluoropolymer, a nanostructured fluoropolymer encapsulated by an encapsulating polymer, or a combination thereof. The matrix polymer component includes polybutylene terephthalate (PBT), polyetherimide (PEI), polyethylene terephthalate (PET), polycarbonate (PC), poly(p-phenylene oxide) (PPO), polystyrene (PS), polyphenylene sulfide (PPS), polypropylene (PP), polyamide (PA), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polybutylene naphthalate (PBN), copolymers thereof, or a combination thereof. Methods for forming foamed polymer compositions, including core-back molding methods and extrusion foaming methods, are also described.

Modified plastic surfaces with perfluoropolymers are provided, whereby plastic surfaces that are intended for use under tribological conditions have substantially improved assembly properties and/or sliding friction properties and exhibit a very low degree of wear. Accordingly, modified plastic surfaces with perfluoropolymers are provided in which, after a reactive conversion under mechanical stress at room temperature, at least the reactive —NH groups and/or —OH groups present at the surface of plastics are present in a chemically covalently coupled manner with the perfluoropolymer carboxylic acid halide present at least in the surface-proximate region of modified perfluoropolymer (micro)powders and/or with the grafted (meth)acrylic acid halide present via perfluoropolymer (peroxy) radicals of the perfluoropolymer (micro)powders and/or (meth)acrylic acid that has been modified into (meth)acrylic acid halide before the reactive conversion.

Disclosed herein are a method of manufacturing dry binders for electrodes usable in a dry electrode method by using a mixture of polymer powder containing a hydroxyl group (—OH) and polytetrafluoroethylene, and a method of manufacturing dry electrodes including dry binders.

A method for forming foamed beads includes: saturating pellets with a blowing agent to form saturated pellets; and depressurizing the saturated pellets in a pressure vessel to form the foamed beads. The pellets include: a matrix polymer component, and from 0.01 wt% to 2 wt%, based on the weight of the pellets, of a nanostructured fluoropolymer, a nanostructured fluoropolymer encapsulated by an encapsulating polymer, or a combination thereof.

A method for producing low molecular weight polytetrafluoroethylene which includes: (1) feeding into an airtight container in the absence of oxygen: high molecular weight polytetrafluoroethylene: and a halogenated polymer having a halogen atom other than a fluorine atom; and (2) irradiating the high molecular weight polytetrafluoroethylene to provide low molecular weight polytetrafluoroethylene having a melt viscosity at 380° C. of 1.0×10.sup.2 to 7.0×10.sup.5 Pa.Math.s.

A polymer electrolyte membrane according to the present invention has a cluster diameter of 2.96 to 4.00 nm and a converted puncture strength of 300 gf/50 μm or more. The polymer electrolyte membrane according to the present invention has a low electric resistance and an excellent mechanical strength.

A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

A fiber reinforced thermoplastic resin molded article contains inorganic fibers (A), organic fibers (B), and a thermoplastic resin (C), the fiber reinforced thermoplastic resin molded article containing 5 to 45 parts by weight of the inorganic fibers (A), 1 to 45 parts by weight of the organic fibers (B), and 10 to 94 parts by weight of the thermoplastic resin (C), based on 100 parts by weight of the total of the inorganic fibers (A), the organic fibers (B), and the thermoplastic resin (C), the inorganic fibers (A) in the fiber reinforced thermoplastic resin molded article having a weight average fiber length (L.sub.wa) of 0.01 mm or more and 3 mm or less, the organic fibers (B) having a weight average fiber length (L.sub.wb) of more than 4 mm and 20 mm or less.

To provide a release film having an electrostatic dissipative property. The present invention provides a release film comprising a base layer formed of a polyester resin and a surface layer formed of a tetrafluoroethylene resin that comprises an electrically conductive filler, and the release film has a surface resistivity Rs of 1×10.sup.11Ω or less. Preferably, the electrically conductive filler comprises carbon black, and the tetrafluoroethylene resin further comprises particles having an average particle size of 1 μm to 15 μm determined by laser diffraction particle size analysis.

A fluorinated polymer suitable for deposition and capable of favorable metal patterning, is provided. A resin film containing such a fluorinated polymer as a material is provided. Further, a photoelectronic element having such a resin film in its structure is provided.

A fluorinated polymer which satisfies the following requirements (1) to (3): (1) the melting point is less than 200° C., or no melting point is observed, (2) the thermogravimetric loss rate when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, substantially reaches 100% at 400° C. or lower, (3) when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, the temperature width from a temperature at which the thermogravimetric loss rate is 10% to a temperature at which it is 90%, is within 200° C.