The invention relates to a panel, in particular a decorative panel, a floor panel, a ceiling panel or a wall panel. The invention also relates to a covering consisting of a plurality of mutually coupled panels according to the invention, in particular a floor covering consisting of a plurality of mutually coupled panels, according to the invention.

A film is described comprises a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

A polyvinyl acetal resin film for laminated glass, a viscosity of toluene/ethanol=1/1 (by mass ratio) solution of a polyvinyl acetal resin in a resin composition constituting the polyvinyl acetal resin film with a concentration of 10% by mass, measured at 30 rpm and 20° C. by using a Brookfield-type (B-type) viscometer, being more than 200 mPa.Math.s, the polyvinyl acetal resin film comprising a plasticizer in an amount of 0 to 20% by mass based on a total mass of the resin composition constituting the polyvinyl acetal resin film, and the polyvinyl acetal resin film having a thickness of 10 to 350 μm.

The present invention addresses the problem of providing a prepreg that has excellent short-time and low-pressure handling properties, during pasting and layering work. In order to solve the problem, this invention has the following configuration. The prepreg includes reinforcing fibers and an epoxy resin composition, has a fiber content of 90 mass % or less, and satisfies conditions (a) and (b) below. (a) When the average thickness of the prepreg is set as D (D being 3 μm or greater), the viscosity at 25° C. of the epoxy resin composition at a site (I) located at a depth of D/4 to 3D/4 from the surface on one side of the prepreg is 50,000 to 300,000 Pa.Math.s inclusive. (b) From among sites (II) located at a depth of up to 0.5 μm from each surface on both sides of the prepreg, the viscosity at 25° C. of the epoxy resin composition at least at a site (II) on the one side is 10,000 to 40,000 Pa.Math.s inclusive.

Embodiments of the present disclosure generally relate to housings for, e.g., memory devices and electronic devices, and to processes for forming such housings. In an embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component comprising a thermoplastic and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W/mK or more, or combinations thereof.

A film is described comprising a (meth)acrylic polymer and a polyvinyl acetal (e.g. butyral) resin. In some embodiments, the film has a glass transition temperature (i.e. Tg) ranging from 30° C. to 60° C. In some embodiments, the film has a gel content of at least 20% or greater. In some embodiments, the film has an elongation at break of at least 175%. The film typically comprises photoinitiator as a result of the method by which the film was made. The film may be a monolithic film or a layer of a multilayer film.

The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 5 to 350 μm, and satisfies the following Formulae (1) and (2) where, comparing one surface and the other surface, a mean value of the 10-point average roughness of a rougher surface A and a mean value of the 10-point average roughness of a smoother surface B are defined as Rz1(a) μm and Rz2(a) μm, respectively:
Rz1(a)>1.1×Rz2(a)  (1)
3>Rz2(a)  (2), a value obtained by dividing the standard deviation of the 10-point average roughness of the surface A by Rz1(a) and a value obtained by dividing the standard deviation of the 10-point average roughness of the surface B by Rz2(a) are each 0 to 0.30, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C. and 30 rpm using a Brookfield-type (B-type) viscometer, is 100 to 1,000 mPa.Math.s, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

An object is to provide an incised prepreg having desired formability stably, wherein the incised prepreg contains unidirectionally oriented reinforcing fibers and matrix resin and has an incised region containing a plurality of incisions made to divide reinforcing fibers, wherein the incised region includes a plurality of incision rows, each containing a plurality of incisions having nearly equal fiber-directionally projected lengths and aligned at substantially constant intervals in the fiber direction and wherein the distance L1, measured at right angles to the fiber direction, between two incision rows located on either side of an arbitrarily selected incision row and the fiber-directionally projected length L2 of the latter incision row satisfy the following relation: −1.0<L1/L2<0.5.

Disclosed is a cellulose ester-based composition, The cellulose ester-based composition of the present invention includes comprising at least 51% by weight cellulose ester based on the total weight of polymer in the composition and polyvinyl acetal. Related calendered articles and flooring articles are also described.

A porous film includes at least one porous polyimide film that includes a polyimide resin, an organic amine compound and a resin other than a polyimide resin, and that does not include a polar aprotic solvent, wherein a content of the organic amine compound is 0.001% by weight or higher with respect to a total weight of the porous polyimide film.