A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one impact modifier. The structural adhesive film exhibits an elongation at break of at least 300% according to tensile test DIN EN ISO 527 and a free expansion rate according to EN 2667-3 of at least 45%.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

A method is proposed for producing a functional material, wherein in at least one mixing step (14) a pulverized rigid foam (16) and at least one binding agent (18) are mixed to form a raw mass, and wherein in at least one pressing step (22) the raw mass is pressed to form the functional material, the method proceeding in a continuous manner at least from the mixing step (14) up to and including the pressing step (22).

A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): ##STR00001##
wherein m, n, l, R.sub.1, and R.sub.2 are as defined in the specification.

Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2). ##STR00001##

A high-strength network structured nano-carrier material and a preparation method and application thereof. A nano-cellulose solution and graphene are mixed and ultrasonication is performed in an ultrasonic pulverizer to obtain a nano-cellulose/graphene suspension. The suspension with a phenolic resin adhesive is mixed and stirred to obtain a nano-cellulose/graphene/phenolic resin suspension. The nano-cellulose/graphene/phenolic resin suspension is injected into a mold. The mold is placed in a freeze dryer for freezing and vacuum dried in two stages to obtain a nano-cellulose/graphene/phenolic resin aerogel. The aerogel is preheated and cured in a muffle furnace, then subjected to a high-temperature thermal decomposition treatment in a tube furnace to obtain a nano-carrier material having a high-strength network structure. The preparation method is simple and convenient, low in cost, environmentally friendly and green. The obtained carrier material has a good water resistance and a high mechanical property, and can carry more active substances.

A functional material has, as a first component, a thermoset plastic material, as a second component, a binding material for binding the thermoset plastic material, and, as a third component, at least one additive, which is configured to improve a burning behavior, wherein the burning behavior corresponds at least to a fire reaction class C as given by DIN EN 113501-1 [German/European norm 113501-1]. A method is intended for producing such a functional material and an element is produced from such a functional material.