The present invention relates to a polymer composition comprising a (meth)acrylic polymer and a multistage polymer. In particular the present invention it relates to polymer composition comprising a (meth)acrylic polymer and a multistage polymer that can be used as a masterbatch. More particularly the present invention relates also to a process for preparing a polymer composition comprising a (meth)acrylic polymer and a multistage polymer by spray drying or coagulation.

A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×10.sup.3 to 2.0×10.sup.8 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.

A fiber reinforced thermoplastic resin molded article includes a thermoplastic resin [A] and carbon fibers [B], a content of the thermoplastic resin [A] being 50 to 95 parts by weight and a content of the carbon fibers [B] being 5 to 50 parts by weight per 100 parts by weight of a total of the thermoplastic resin [A] and the carbon fibers [B], the molded article having a bending elastic modulus of 30 GPa or more, an interfacial shear strength between the thermoplastic resin [A] and the carbon fibers [B] being 15 MPa or more, and a logarithmic decrement of the molded article calculated by Formula (1) of less than 3, wherein the carbon fibers [B] have a weight-average fiber length (L.sub.w) of 0.5 to 10.0 mm:

Logarithmic decrement δ=(1/n)×ln(α.sub.(1)/α.sub.(1+n))  (1).

The present invention addresses the problem of providing a prepreg that has excellent short-time and low-pressure handling properties, during pasting and layering work. In order to solve the problem, this invention has the following configuration. The prepreg includes reinforcing fibers and an epoxy resin composition, has a fiber content of 90 mass % or less, and satisfies conditions (a) and (b) below. (a) When the average thickness of the prepreg is set as D (D being 3 μm or greater), the viscosity at 25° C. of the epoxy resin composition at a site (I) located at a depth of D/4 to 3D/4 from the surface on one side of the prepreg is 50,000 to 300,000 Pa.Math.s inclusive. (b) From among sites (II) located at a depth of up to 0.5 μm from each surface on both sides of the prepreg, the viscosity at 25° C. of the epoxy resin composition at least at a site (II) on the one side is 10,000 to 40,000 Pa.Math.s inclusive.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm.sup.3, and when heated at 100° C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%.

An object of the present invention is to provide a fiber-reinforced thermoplastic resin sheet which can be manufactured into a molded body exhibiting excellent appearance quality as well as exhibits both high moldability and strength and a manufacturing method of such a fiber-reinforced thermoplastic resin sheet. The present invention relates to a fiber-reinforced thermoplastic resin sheet which is a random laminated body of a tape-shaped unidirectional prepreg and contains spread reinforcement fibers and a polymer (a) and in which the polymer (a) is a polymer of at least a bisphenol A type epoxy compound represented by Formula (1): ##STR00001##
where n is an integer of 1 to 4
and a bisphenol compound selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, and bisphenol P.

A thermoplastic resin composition for a millimeter-wave radar member, is provided, which comprises, relative to 100 parts by mass of a polybutylene terephthalate resin (A), 15 to 65 parts by mass of a rubber-reinforced polystyrene resin (B1) and/or 10 to 70 parts by mass of a polycarbonate resin (B2) as a component (B), 0.1 to 3 parts by mass of an epoxy compound (D), and 30 to 150 parts by mass of glass fiber (E).

[Problem] A metal-fiber reinforced resin material composite is provided which improves the shear strength between a metallic member and a fiber reinforced material by more strongly bonding the metallic member and the fiber reinforced resin member, and which is very light and has excellent workability while increasing strength. [Solution] This metal-fiber reinforced resin material composite is provided with a metallic member and with a fiber reinforced resin material that is stacked on at least one surface of the metallic member and combined with the metallic member, wherein the fiber reinforced resin material comprises a matrix resin containing a thermoplastic resin, a reinforcing fiber material included in the matrix resin, and a resin layer interposed between the reinforcing fiber material and the metallic member and comprising a resin of the same type as the matrix resin. The shear strength of the metallic member and the fiber reinforced resin material is greater than or equal to 0.8 MPa.

Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.