A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.
0.12<{(a1+a2)/2}/B  (1)
0.8≤a1/a2≤1.25  (2)

A curable composition including a first compound having a group represented by general formula (x) and an epoxy group and having a molecular weight of 1000 or less. In the general formula (x), Rf.sub.1 and Rf.sub.2 each independently represent a fluorine-containing alkyl group.

—C(Rf.sub.1)(Rf.sub.2)—OH  (x)

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): ##STR00001##
(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, OC.sub.2H.sub.5, NO.sub.2, halogen, or NH—CO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

A resin composition may suppress color fading after a weathering test and excel in heat resistance. A formed article may use of such resin composition, as may a kit, a car-borne camera component, a car-borne camera module. A resin composition may include: per 100 parts by mass of a resin component that contains 50 to 95% by mass of a polybutylene terephthalate resin (A), and 5 to 50% by mass of a thermoplastic resin (B) that demonstrates a glass transition temperature, measured with use of a differential scanning calorimeter, higher by 15 to 150° C. than that of the polybutylene terephthalate resin (A); 0.001 to 5 parts by mass of a dye; and 5 to 100 parts by mass of an inorganic filler.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

An object of the present invention is to provide a novel fiber-reinforced epoxy resin material having improved strength. The fiber-reinforced epoxy resin material of the present invention comprises a cured product of an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises a novolac type epoxy resin as an epoxy resin component, and the cured product of the epoxy resin composition has a swelling ratio in a range from 20 mass % to 44 mass % in methyl ethyl ketone.

A self-adhesive prepreg comprising a fibre reinforcement layer having a first side and a second side, wherein the first side of the fibre reinforcement layer has been pre-impregnated with a self-adhesive resin composition. The self-adhesive may be used as a structural reinforcement and is especially adapted for direct bonding to oily steel or galvanized steel in the automotive, aerospace and other sheet metal fabrication industries.

The present invention relates to a prepreg which is manufactured by impregnating thermosetting resin composition and at least one thermoplastic additive into unidirectional carbon fiber, and to a resin composition for high speed curing prepreg for car body parts through press method and a prepreg product containing the same by differentiating a resin constituent, a resin equivalent weight, viscosity, gel time and glass transition temperature differing from those described in the prior art.