C08J2463/08

Golf club shaft

An object of the present invention is to provide a golf club shaft having excellent strength. The present invention provides a golf club shaft made of a fiber-reinforced epoxy resin material comprising a cured product of an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises at least one selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin and a novolac type epoxy resin, and a tetraglycidyl type epoxy resin as an epoxy resin component, and the cured product of the epoxy resin composition has a swelling ratio in a range from 20 mass % to 44 mass % in methyl ethyl ketone.

Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): ##STR00001##
wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

THERMAL CONDUCTIVE RESIN COMPOSITION, THERMAL CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE

The thermal conductive resin composition of first embodiment includes an epoxy resin, a cyanate resin, and thermal conductive filler. It has a thermal conductivity at 25 C., and cracking does not occur when a specific flex resistance test is carried out. The thermal conductive resin composition of a second embodiment includes an epoxy resin, a thermal conductive filler, and silica nanoparticles. An average particle diameter D.sub.50 of the silica nanoparticles is equal to or more than 1 nm and equal to or less than 100 nm, a content of the silica nanoparticles is equal to or more than 0.3% by mass and equal to or less than 2.5% by mass with respect to 100% by mass of a total solid content of the thermal conductive resin composition. The thermal conductive filler includes secondary agglomerated particles constituted of primary particles of scale-like boron nitride.

Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same

A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I):

##STR00001##

wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Resin-coated metal sheet for containers

The resin-coated metal sheet for containers includes a resin coating layer (A) having a multilayered structure mainly composed of a polyester resin on at least one surface thereof. The resin coating layer (A) includes a resin layer (a1). The resin layer (a1) adheres to the metal sheet, contains (i) a polyester resin, (ii) a phenolic resin, (iii) a metal alkoxide compound and/or a metal chelate compound, (iv) an epoxy resin, and (v) at least one selected from the group consisting of polyamine resins, polyamidoamine resins, and polyamide resins, and is mainly composed of the polyester resin. Preferably, a polyester film (a2) is disposed on the resin layer (a1).