A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.

Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.

Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.

Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.

A dielectric film is provided. The dielectric film includes a dielectric polymer substrate having two surfaces opposite to each other and a coating layer formed on at least one of the two surfaces of the dielectric polymer substrate by chemical vapor deposition polymerization and/or irradiation polymerization. A power capacitor includes the dielectric film. A process for preparing the dielectric film is provided.

An article comprises a carbon fibre reinforced plastic (CFRP) substrate, a buffer layer disposed adjacent the substrate, the buffer layer comprising a poly(para-xylylene) polymer; and a moisture barrier coating disposed adjacent the buffer layer.

A laminated sheet includes a polymer layer selected from the group consisting of polyalkylene phthalate, polyalkylene isophthalate, polyalkylene terephthalate, and combinations thereof, and two poly(,,,-tetrafluoro-para-xylylene) layers respectively connected to two opposite surfaces of the polymer layer.

Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.

A substrate surface may be modified with a polymer coating to render the surface suitable for plasma functionalization. The polymer coating is deposited onto the surface at ambient temperature to a thickness of less than 0.1 m. The polymer coating includes poly(p-xylylene) or a derivative thereof, and is capable of penetrating into pores of a porous substrate while no substantially altering the porosity of the substrate. The coated substrate is selected from a material lacking a primary or secondary aliphatic hydrogen atom.