Patent classifications
C08J2471/10
FIBER-REIMFORCED MOLDED BODIES MADE OF EXPANDED PARTICLE FOAM MATERIAL
The present invention relates to a molding made of expanded bead foam, wherein at least one fiber (F) is partly within the molding, i.e. is surrounded by the expanded bead foam. The two ends of the respective fibers (F) that are not surrounded by the expanded bead foam thus each project from one side of the corresponding molding. The present invention further provides a panel comprising at least one such molding and at least one further layer (S1). The present invention further provides processes for producing the moldings of the invention from expanded bead foam or the panels of the invention and for the use thereof, for example as rotor blade in wind turbines.
SLIDING TENDONS FOR HIGH-STRAIN ELASTOMER ACTUATORS
A soft structure fiber reinforcement and actuation technology is provided. In an example embodiment, the tendon-driven, fiber-reinforced elastomer membrane comprises an elastomer matrix material and a fiber array embedded within the elastomer matrix material. The one or more tendons are not mechanically bonded to the elastomer matrix material, such that the one or more embedded tendons are able to move through the elastomer matrix material. One or more apparatuses may employ one or more such tendon-driven, fiber-reinforced elastomer membranes for use in a variety of applications.
EPOXY MOLDING COMPOUNDS, PREPARATION METHOD THEREOF, AND USE THEREOF
The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.
RESIN COMPOSITION, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLADDED LAMINATE SHEET, AND WIRING BOARD
A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.
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In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.
RESIN COMPOSITION, PREPREG OBTAINED USING SAME, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD
One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.
IMPLANTABLE MEDICAL DEVICE WITH VARIED COMPOSITION AND POROSITY, AND METHOD FOR FORMING SAME
A method for forming a thermoplastic body having regions with varied material composition and/or porosity. Powder blends comprising a thermoplastic polymer, a sacrificial porogen and an inorganic reinforcement or filler are molded to form complementary parts with closely toleranced mating surfaces. The parts are formed discretely, assembled and compression molded to provide a unitary article that is free from discernible boundaries between the assembled parts. Each part in the assembly has differences in composition and/or porosity, and the assembly has accurate physical features throughout the sections of the formed article, without distortion and nonuniformities caused by variable compaction and densification rates in methods that involve compression molding powder blends in a single step.
PEI or PEI-PEEK particle foams for applications in lightweight construction
Polymer foams based on polyetherimides (PEI) or blends of polyetherimides and polyether ether ketone (PEEK) meet the legal requirements demanded by the aviation industry for aircraft interiors and for aircraft exteriors too.
Metal-fiber-reinforced resin material composite and production method thereof
[Problem] A metal-fiber reinforced resin material composite is provided which improves the shear strength between a metallic member and a fiber reinforced material by more strongly bonding the metallic member and the fiber reinforced resin member, and which is very light and has excellent workability while increasing strength. [Solution] This metal-fiber reinforced resin material composite is provided with a metallic member and with a fiber reinforced resin material that is stacked on at least one surface of the metallic member and combined with the metallic member, wherein the fiber reinforced resin material comprises a matrix resin containing a thermoplastic resin, a reinforcing fiber material included in the matrix resin, and a resin layer interposed between the reinforcing fiber material and the metallic member and comprising a resin of the same type as the matrix resin. The shear strength of the metallic member and the fiber reinforced resin material is greater than or equal to 0.8 MPa.
CROSSLINKED OLEFIN-BASED THERMOPLASTIC ELASTOMER EXPANDED BEAD AND METHOD FOR PRODUCING SAME
A crosslinked olefin-based thermoplastic elastomer expanded bead including a base polymer having an olefin-based thermoplastic elastomer and a brominated bisphenol-based flame retardant having a chemical structure represented by formula (1). A difference Tm.sub.TPO-T.sub.FR is −5° C. to 40° C., where Tm.sub.TPO is a melting point of the olefin-based thermoplastic elastomer and T.sub.FR is the lower of a glass transition temperature T.sub.gFR and a melting point Tm.sub.FR of the brominated bisphenol-based flame retardant. A xylene insoluble content is 5 mass % to 80 mass %. R.sup.1 and R.sup.3 in the formula (1) are monovalent substituents, R.sup.2 is a divalent substituent, and n is an integer from 1 to 6:
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Resin composition, copper clad laminate and printed circuit board using same
The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).