The present disclosure relates to a polyamide molding composition including a semi-aromatic, semi-crystalline copolyamide and flat glass fibers that shows a low tendency to absorb moisture and thus maintains its excellent mechanical and optical properties also during storage and/or use.

A soft structure fiber reinforcement and actuation technology is provided. In an example embodiment, the tendon-driven, fiber-reinforced elastomer membrane comprises an elastomer matrix material and a fiber array embedded within the elastomer matrix material. The one or more tendons are not mechanically bonded to the elastomer matrix material, such that the one or more embedded tendons are able to move through the elastomer matrix material. One or more apparatuses may employ one or more such tendon-driven, fiber-reinforced elastomer membranes for use in a variety of applications.

The present invention relates to a polymer film (P) containing a polyamide composition (PC) that comprises an amorphous polyamide (A) and a semicrystalline polyamide (B) and to a method for producing the polymer film (P). The present invention further relates to a method for packaging food products with the polymer film (P).

The present invention relates to a method for producing foam and foam produced thereby. The method for producing foam includes a step for producing foam by kneading and injection molding a first extrusion product and a second extrusion product, wherein the first extrusion product is obtained by extruding a first composition including an aromatic vinyl-based resin, and the second extrusion product is obtained by extruding a second composition including a polyamide resin and a foaming agent.

A sizing agent for matrix-resin-reinforcement fibers that simultaneously attains excellent cohesion and abrasion resistance of sized fibers, uniform size application on fiber surface and good bonding between sized fiber and a matrix resin; a synthetic fiber strand sized therewith; and a fiber-reinforced composite material reinforced by the sized fiber strand. The sizing agent contains a polyamide (A), a carbodiimide group-containing compound (B) and water (C), wherein the polyamide (A) has a melt viscosity ranging from 100 to 15,000 mPa.Math.s at 150° C. and the compound (B) has at least two carbodiimide groups per molecule. The polyamide (A) is preferably a water-soluble polyamide.

A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

The use of a composition including a mixture of at least one non-reactive thermoplastic polymer of Tg >40° C., especially >100° C., in particular >120° C., and at least one reactive thermoplastic prepolymer, with a fibrous material, for the preparation of a fibrous material impregnated with the composition, the composition having an initial melt viscosity during the impregnation, as measured in plate-plate rheology under 1 Hz and 2% strain, at a temperature of 300° C., of less than the viscosity of the same composition devoid of reactive prepolymer, measured under the same conditions, and/or a ductility, after in situ polymerization of the reactive thermoplastic prepolymer in the composition during the impregnation and after the impregnation, that is at least equivalent to the ductility of the same composition devoid of non-reactive thermoplastic polymer, and of which said reactive thermoplastic prepolymer is polymerized to the same number-average molecular mass (Mn).

Embodiments of the present disclosure generally relate to housings for, e.g., memory devices and electronic devices, and to processes for forming such housings. In an embodiment, an article for housing at least a portion of an electronic device is provided. The article includes a first component comprising a thermoplastic and a biodegradable filler or polymer, and a second component disposed on at least a portion of the first component, the second component comprising a plurality of layers. The article has a scratch visibility load of about 200 gms or more, an electrostatic discharge static voltage of about 100 V or less, a thermal conductivity of about 0.28 W/mK or more, or combinations thereof.

Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight M.sub.n of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight M.sub.n of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.