The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

A method of applying a gas-impermeable coating includes forming a polyelectrolyte complex suspension. The polyelectrolyte complex suspension is applied to a substrate. The substrate having the polyelectrolyte complex applied thereon is treated. The treating reduces salt content of the polyelectrolyte complex. The treating results in a gas-impermeable coating being formed on the substrate.

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

Modified nanocellulose particle include a nanocellulose particle, a binder coating the particle, and an alkyl amine affixed to the binder coating. A method of modifying nanocellulose particles includes adding a binder and a hydrophobizing agent to a slurry of nanocellulose particles in water, modifying the nanocellulose particles with the binder and hydrophobizing agent, and collecting the modified nanocellulose particles.

A method of applying a gas-impermeable coating includes forming a polyelectrolyte complex suspension. The polyelectrolyte complex suspension is applied to a substrate. The substrate having the polyelectrolyte complex applied thereon is treated. The treating reduces salt content of the polyelectrolyte complex. The treating results in a gas-impermeable coating being formed on the substrate

Compositions for forming coatings disclosed herein can include a cationic polyelectrolyte, an anionic polyelectrolyte, nanostructures, and a crosslinking agent. The compositions, coatings, methods, and kits described herein can have improved tribological properties, hardness, and strength.

The present invention relates to a method for producing a polyelectrolyte complex (PEC) membrane having a predetermined porosity via salt dilution induced phase separation, in which a liquid polymer solution (P) containing polyanions (A) and polycations (C) dissolved in an aqueous medium at an overcritical salt concentration is exposed to an aqueous medium.

The invention discloses a carbon nanotube/polyetherimide/thermosetting resin dielectric composite and a preparation method therefor. 100 parts by weight of polyetherimide and 1-7 parts by weight of carbon nanotube are mixed uniformly in an Haake torque melt cavity to obtain a carbon nanotubes/polyetherimide composite; 20 parts of the carbon nanotube/polyetherimide composite are dissolved in 100-150 parts of dichloromethane, then the mixed solution is added in 100 parts of molten thermocurable thermosetting resin, mixing, and heat preserving, stirring are performed until a mixture is formed in a uniform state, and curing and post-treating are performed to obtain a carbon nanotube/thermosetting resin dielectric composite, wherein the substrate thereof has a typical reverse phase structure, while the carbon nanotubes are dispersed in a polyetherimide phase. The composite has a relatively low percolation threshold, a high dielectric constant and a low dielectric loss. The preparation method of the present invention has a simple process and is suitable for large-scale production.