Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

Solid-state branching and/or crosslinking of aliphatic polyamide or polyester articles is achieved using a topical approach. A surface of the article is coated with a composition that includes a polyene and a free radical initiator. The article and applied coating are then heated to induce branching and/or crosslinking in the polyamide or polyester. This is performed below the crystalline melting temperature of the polyamide or polyester, or in the case of a fabric, below the melting temperature of the fibers in the fabric. Fabrics treated in this manner exhibit reduced or even no dripping in vertical flame tests.

The invention relates to plastic films and a silicone containing polymer blend composition that can be used in the production of the plastic films which is a polymer composition obtainable from, per 100 parts by weight of the composition, 99.99 to 90 parts by weight of a polyolefin polymer (P) and 0.01 to 10 parts by weight of a masterbatch (M).

A liquid repellent structure includes a surface to which liquid repellency is to be imparted, and a liquid repellent layer formed on the surface. In the structure: the liquid repellent layer contains a binder resin containing a fluorine-containing resin, and a filler dispersed in the binder resin; the filler contains a first filler having a BET specific surface area M of 100 m.sup.2/g to 400 m.sup.2/g; and the ratio M/F of the BET specific surface area M of the first filler to a mass F (mass %) of the fluorine-containing resin relative to the total mass of the liquid repellent layer is 4.1 to 20.0.

Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.

A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.

A method for producing an electronic component having an electromagnetic shield includes: sticking a temporary protective material to a body to be processed having irregularities on a surface thereof; curing the temporary protective material by light irradiation; singularizing the body to be processed and the temporary protective material; forming a metal film at a part of the singularized body where the temporary protective material is not stuck; and detaching the singularized body having the metal film formed thereon from the temporary protective material. The temporary protective material is formed from a resin composition having a shear viscosity at 35° C. of 5000 to 30000 Pa.Math.s before photocuring and having an elastic modulus at 25° C. of 100 MPa or less and an elongation percentage of 35% or more in a tensile test, after photocuring by light irradiation with an exposure amount of 500 mJ/cm.sup.2 or greater.

The present invention relates to a photocurable coating composition for forming a low refractive layer, a method for preparing an antireflection film using the photocurable coating composition, and an anti-reflective film prepared by using the photocurable coating composition. According to the present invention, a low refractive layer is formed of a photocurable coating composition containing two or more types of photo-polymerizable compounds, a photoinitiator, surface-treated hollow inorganic nanoparticles, and surface-treated solid inorganic nanoparticles.

The present invention relates to a curable silicone composition comprising: (A) at least one organopolysiloxane having at least two alkenyl groups per molecule; (B) at least one mercapto functional organopolysiloxane having at least two thiol groups per molecule; (C) at least one photopolymerization initiator; and, (D) 2,6-di-tert-butyl-4-methylphenol (BHT), wherein the composition has a viscosity of less than 200 mPa.Math.s at 25° C.

A crosslinked silicone material Y obtained by heating to a temperature of between 70 and 200° C., a crosslinkable composition X including an organopolysiloxane compound A containing, per molecule, at least two C.sub.2-C.sub.6 alkenyl radicals bonded to silicon atoms; an organohydrogenopolysiloxane compound B containing, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom; a catalyst C of formula [Ni(L.sup.1).sub.2] where Ni represents nickel at degree of oxidation II; L.sup.1 which may be identical or different, represents a β-dicarbonylato anion or the enolate anion of a β-dicarbonylated compound; optionally an adhesion promoter D; and optionally a charge E.