Patent classifications
C08J5/125
METHOD OF MAKING ZIPPER POUCH
Provided is a process for preparing a zipper pouch, wherein the process comprises: A) forming a first laminate by a process comprising i) bringing together a polyisocyanate component and a polyol component to form an adhesive composition, ii) applying a layer of the adhesive composition to a layer of polyethylene terephthalate, iii) then contacting the layer of the adhesive composition with a layer of polyethylene having thickness of 80 micrometer or more; B) contacting a polymeric zipper construction to the first laminate at temperature of 200 C or higher. Also provided is a zipper pouch made by that process.
Solvent cement formulations
Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
ADHESIVE COMPOSITION FOR OIL SILICONE RUBBER
An adhesive composition for oil bleeding silicone rubber comprising any of: (A) an alcohol-based organic solvent solution adding 45 to 120 parts by weight of organometallic compound and 2 to 10 parts by weight of water, based on 100 parts by weight of vinyltrialkoxysilane, (B) a solution in which 5 parts by weight or less, preferably 1 to 5 parts by weight, of 3-aminopropyltrialkoxysilane is added to the above alcohol-based organic solvent solution (A), or (C) a solution in which uncrosslinked silicone rubber dissolved beforehand in an organic solvent is added to the above alcohol-based organic solvent solution (A) or (B) in which the amount of the organometallic compound is changed to 5 to 20 parts by weight, at a ratio of 0.1 to 5 wt. %, based on the total solid matters of vinyltrialkoxysilane and the organometallic compound. The adhesive composition has excellent adhesion to various substrates, including metals.
Gas barrier film and method for producing gas barrier film
A gas barrier film has, in sequence, a support, an inorganic layer disposed on one surface side of the support, an adhesive layer disposed on a surface of the inorganic layer, and a resin layer disposed on a surface of the adhesive layer in which the adhesive layer has a thickness of 15 μm or less, and the adhesion strength between the inorganic layer and the adhesive layer is 21 N/25 mm or more and 60 N/25 mm or less. A method for producing a gas barrier film includes an inorganic layer deposition step and a bonding step in a vacuum.
Polymer-metal junction
Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.
ADHESIVE FOR CASTABLE URETHANES
Provided are adhesives containing a phenoxy resin grafted with methyl methacrylate (MMA) and/or methacrylic acid (MAA), and including a uretdione or a silane. The adhesive compositions are completely or substantially absent free isocyanate. The grafted phenoxy resin forms crosslinking which allows the adhesive to chemisorb to a metal surface, diffuse and entangle in a urethane elastomer and/or provide crossbridging and/or crosslinking across an interface of the adhesive and a cast urethane. Methods of adhering a castable urethane to a substrate, using the provided adhesives, are also provided.
COMPOSITIONS INCLUDING PVC OR CPVC
The present disclosure provides a PVC or CPVC solvent cement and a composition for forming a PVC or CPVC coating on an object. The solvent cement and the coating composition each include one or more caprolactam-derived solvents and a polymer selected from the group of polyvinyl chloride and chlorinated polyvinyl chloride. The one or more caprolactam-derived solvents include a linear alkyl group of 1, 2 or 4 unsubstituted carbons or an alkoxymethyl group of 2 or 3 unsubstituted carbons bonded to a nitrogen heteroatom.
BONDING COMPOSITION FOR JOINING POLYMER COMPONENTS BY MATERIAL ENGAGEMENT
A bonding composition joins polymer components by material engagement. The bonding composition includes a solvent and a polymer material, which may be made from similar polymers from which the polymer components are made. There may be a kit for producing a polymer components and a bonding composition. The polymer production includes volatilization of the solvent and optionally melting the polymer materials.
Infrared-reflecting optically transparent assembly and method of making the same
A method of making an infrared-reflecting optically transparent assembly comprises: coating a curable composition onto a major surface of an optically transparent thermoplastic polymer film; at least partially curing the curable composition, which may be optionally at least partially dried, to provide a thermoformable composite film; and laminating the thermoformable composite film to an infrared-reflecting multilayer optical film to provide the infrared-reflecting optically transparent assembly. The curable composition comprises urethane (meth)acrylate compound, (meth)acrylate monomer, and silicone (meth)acrylate. The infrared-reflecting optically transparent assembly and methods of including it in an infrared-reflecting lens assembly are also disclosed.
POLYMER-METAL JUNCTION
Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.