In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

The present invention addresses the problem of providing a prepreg that yields a carbon fiber composite material that has exceptional tensile strength, heat resistance, and impact resistance and is suitable as a structural material of an aircraft body, wherein the resin composition used in the prepreg furthermore has exceptional viscosity stability, the prepreg containing a resin composition that contains carbon fibers and at least the constituent elements [A]—[D] as defined.

The invention relates to a pre-impregnated fibre-reinforced composite material in laminar form, obtained impregnating a fibrous mass with a polymeric binder composition and intended to be subjected to successive forming and complete curing operations to produce a fibre-reinforced composite material. The polymeric binder composition comprises one or more resins chosen in the group consisting of siloxane resins and silsesquioxane resins, and can optionally comprise one or more organic resins. The polymeric binder composition appears as a liquid with viscosity between 55000 and 10000 mPas at temperatures between 50° C. and 70° C. The polymeric binder composition forms a polymeric binder matrix, not cross-linked or only partially cross-linked, that fills the interstices of the fibrous mass. The invention also relates to a method for making said pre-impregnated fibre-reinforced composite material in laminar form. The invention also relates to a manufactured article obtained by hot forming and complete curing of the aforesaid pre-impregnated fibre-reinforced composite material, as well as a method for making said manufactured article.

The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.

Systems and methods are provided for fabrication of enhanced carbon fiber laminates that utilize encapsulated catalyst. One embodiment is a method that includes acquiring a batch of dry fibers, and acquiring a batch of catalyst capsules that each comprise catalyst that accelerates polymerization of monomers of a resin, and a shell that encapsulates the catalyst and liquefies at a curing temperature. The method further includes interspersing the catalyst capsules among the dry fibers, and impregnating the fibers with the resin after interspersing the catalyst capsules with the fibers.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The present invention relates to fiber composite plastic (11, 13) comprising a polymer (40, 41) and at least one textile (50), which has at least one palpably inhomogeneous surface (60, 61) with a textile structure and is entirely surrounded by polymer (40, 41), wherein the fiber composite plastic (11, 13) has at least one palpably inhomogeneous surface (60, 61), wherein inhomogeneities of this fiber composite plastic surface are caused by the textile structure, and a method for producing the fiber composite plastic (11, 13).

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4):

[A]: epoxy resin
[B]: aromatic diamine
[C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.60 or less in a ratio m/M of a molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition. (3): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (2) is 0.01 or more and 0.20 or less; and (4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

Provided is a prepreg containing a urethane (meth)acrylate (A), a polymerization initiator (B), and reinforcement fibers (C), characterized in that the polymerization initiator (B) is an alkyl peroxy ester compound having a 10-hour half-life temperature of 60° C. or higher and lower than 70° C. The prepreg has excellent storage stability and excellent moldability, even under the low-temperature molding condition of 110° C. or lower, and enables to obtain a molded article having excellent physical properties such as interlaminar shear strength. Therefore, the prepreg can be suitably used in automobile components, railway vehicle components, aerospace craft components, ship components, housing equipment components, sporting components, light vehicle components, building and civil engineering components, and casings of OA equipment and the like.

An epoxy resin composition comprises the following components [A] to [E]: [A] epoxy resin, [B] amine-type curing agent, [C] cure accelerator, and [D] red phosphorus. The epoxy resin composition contains, per 100 mass parts for the total amount of [A], 25-45 mass parts of [A1] a liquid bisphenolic epoxy resin and 20-40 mass parts of [A2] a phenol novolac-type epoxy resin, and has a content ratio of [E] to [D] ([E]/[D]) of at least 1. Provided are a light-weight fiber-reinforced composite material that exhibits an excellent flame retardancy and mechanical properties and does not produce halogen gas during combustion, and an epoxy resin composition that has a viscosity suitable for obtaining the fiber-reinforced composite material as well as prepregs.