Patent classifications
C08J7/08
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM
A method of manufacturing a semiconductor device, includes forming a sacrificial film made of a polymer having a urea bond on a substrate by supplying an amine and an isocyanate to a surface of the substrate, wherein the sacrificial film is provided in a specific region of the substrate; performing a predetermined process on the substrate on which the sacrificial film is formed; and removing the sacrificial film by heating the substrate to depolymerize the polymer, wherein a carbon bonded to a nitrogen atom contained in an isocyanate group of the isocyanate is a secondary or tertiary non-aromatic carbon.
AQUEOUS BIOPOLYMER DISPERSIONS
An aqueous biopolymer dispersion composition comprising: a biopolymer selected from the group consisting of: polybutylene adipate terephthalate (PBAT), polybutylene succinate (PBS), polybutylene succinate adipate (PBSA), polylactic acid (PLA), poly(3-hydroxybutyrate) (PHB), polycaprolactone (PCL), poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) (PHBH); poly(3-hydroxybutyrate-co-3-hydroxyvalerate) (PHBV), polyhydroxyalkanoate (PHA), and mixtures thereof; a stabilising agent selected from the group consisting of: polyvinyl alcohol, fatty alcohol ethoxylates, ethylene oxide/propylene oxide (EO/PO) block copolymers, salts of fatty acids and mixtures thereof; a rheology modifier; a cross linking agent; optional further ingredients; and water.
Azobenzene polymer network, and uses thereof for biofilm removal and control over cell attachment
Disclosed methods include formulating azobenzene-based polymer networks to induce a modulus change in a highly crosslinked polymer, in vivo, with no external heat requirement and using a benign light as the source of stimuli. A modulus change can be achieved via a coating on the substrate and within the bulk of the substrate via photoexposure. The azobenzene-based polymer network can be formed as a coating or in the bulk of a material from either a glassy composition comprising methyl methacrylate (MMA), poly (methyl methacrylate) (PMMA), and triethylene glycol dimethacrylate (TEGDMA) or a soft material comprising of long-chain difunctional acrylates. The disclosed technology also includes methods of biofilm disruption and removal from the surface of a substrate, and includes methods of inhibiting biofilm growth and cell attachment to a substrate.
Method of manufacturing modified liquid crystal polymer, liquid crystal polymer composition and method for changing melting point of liquid crystal polymer
A method of manufacturing a modified liquid crystal polymer includes: providing a liquid crystal polymer having a first melting point; heating the liquid crystal polymer to a first temperature and maintaining at the first temperature for a first time period, in which the first temperature is lower than or equal to the first melting point; and cooling the liquid crystal polymer to a second temperature to form a first modified liquid crystal polymer, the second temperature being lower than the first temperature, the first modified liquid crystal polymer having a second melting point, in which the second melting point is higher than the first melting point.
RESIN SHEET, MANUFACTURING METHOD OF RESIN SHEET, AND RESIN COVERING METHOD
A manufacturing method of a resin sheet that is capable of being deformed, covering a front surface of a substrate, and protecting the substrate and that is capable of curing by being given energy from the external includes a liquid resin disposing step of disposing a liquid resin capable of curing by being given the energy from the external on a flat surface and a surface curing step of forming a resin coat layer through curing only an outer circumferential surface of the liquid resin by giving the energy with such intensity that the whole of the liquid resin does not cure to the liquid resin from the external and leaving the liquid resin that is not cured inside the resin coat layer.
Resin molded article comprising wholly aromatic liquid crystalline polyester resin capable of reducing dielectric loss tangent by heat treatment and electrical and electronic component
The invention provides a resin molded article containing a wholly aromatic liquid crystalline polyester resin and formed by being subjected to heat treatment, in which the enthalpy change Δ H.sub.1 at the melting point of the first cycle and the enthalpy change Δ H.sub.2 at the melting point of the second cycle of the temperature elevation process measured by a differential scanning calorimeter satisfy Δ H.sub.1/Δ H.sub.2≥2.0, and the dielectric loss tangent measured by the split-post dielectric resonator (SPDR) method at a measurement frequency of 10 GHz is 0.85×10.sup.−3 or less.
Method of forming nanoparticles having superhydrophobicity
A method of forming nanoparticles having superhydrophobicity includes preparing a PDMS film including a structure having a predetermined shape on a surface thereof, and generating the nanoparticles having superhydrophobicity on the surface of the PDMS film by combusting the surface of the PDMS film using a diffusion flame. Transparent nanoparticles having superhydrophobicity and oleophobicity may be generated simply and easily on the surface of the PDMS film.
Heating of polymeric materials
A material susceptible to dielectric heating has a base polymeric thermoplastic material (1) and a dielectric heating susceptor (2, 3) which increases susceptibility to heating by irradiation with electromagnetic, for example RF or microwave, radiation. The dielectric heating susceptor has a polymeric material (2) such as PVDF which is different from the base polymeric material and has a higher dielectric loss factor than the base polymeric material. The dielectric heating susceptor also comprises electrically polarisable entities such as carbon black dispersed within the base polymeric material without forming a conductive network. The two susceptor materials in combination with the base polymer are particularly effective together at improving susceptibility to electromagnetic radiation heating of the whole material.
GEL COMPOSITIONS WITH TUNABLE HARDNESS
Gel compositions have a tunable hardness controlled by exposure to an external stimulus. Further disclosed herein are methods for making such gel compositions and devices that use such gel compositions. In one aspect, the gel compositions can be used to prepare physical 3-D replicas of the topography of a target surface.
Light-fixable and heat-curing compounds based on epoxy resins and thiols
The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.