Metal nanoparticle agglomerates may render the surface of an article biocidal toward microorganisms. Articles having a biocidal surface may comprise a coating comprising metal nanoparticle agglomerates adhered via an adhesive to at least a portion of a surface of the article. A coating formulation comprising metal nanoparticle agglomerates may be applied to the surface of an article to accomplish the foregoing.

In a method for producing a high-molecular-weight polymer sheet, when a monomer composition including silver nanowires is polymerized, the monomer composition is allowed to stand in a state in which a thickness direction of the obtained high-molecular-weight polymer sheet before the polymerization is a vertical direction, and the silver nanowires in the monomer composition are oriented in the vertical direction and polymerized.

A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

Magnet wire improved partial discharge performance may include a conductor, a first layer of polymeric enamel insulation formed around the conductor, and a second layer of polymeric enamel insulation formed around the first layer. The second layer may be a semi-conductive layer that includes a base polymeric material and filler particles dispersed within the base polymeric material. Additionally, at least sixty percent by weight of the filler particles may be positioned in an outer half of a thickness of the second layer.

A conductive paste composition according to the present disclosure contains silver-coated copper nanowires with a core-shell structure; a binder mixture containing a silicone resin binder and a hydrocarbon-based resin binder; and an organic solvent, such that the conductive paste composition has a low sheet resistance and may withstand a high temperature, thereby implementing excellent conductivity and electromagnetic wave shielding properties. Furthermore, the conductive paste may be widely used in various fields such as electromagnetic wave shielding, solar cell electrodes, electronic circuits.

The present invention particularly relates to synthesizing photo-initiators having poly-oligo-silsesquioxane (POSS) structure and realizing photo-polymerization by using these photo-initiators and simultaneous and in-situ synthesis of Ag nano-particles in polymer matrix comprising POSS structure and obtaining wrinkled surfaces as a result of self-arranging thereof.

Disclosed herein are method and design rules for making polyelemental systems with specific heterostructures, including tetra-phase nanopartides with as many as six junctions. In accordance with an embodiment, a method of making a tetra-phase polyelemental nanoparticle using tri-phase nanoparticle architectures can include selecting two or more triphase nanoparticle architectures, wherein the two or more tri-phase nanoparticle architectures are one or more striped tri-phase architectures, one or more pie-shaped tri-phase architectures, or combinations thereof; identifying from the selected two or more tri-phase nanoparticle architectures groups of metals for generating each of the two or more tri-phase nanoparticle architectures; contacting a tip coated with an ink to a substrate to form a nanoreactor, the ink comprising block copolymer and the metals from the groups of metals identified for generating each of the two or more tri-phase nanoparticle architectures; and annealing the nanoreactors under conditions sufficient to synthesize a tetra-phase polyelemental nanoparticle.