Metal nanoparticle agglomerates may render the surface of an article biocidal toward microorganisms. Articles having a biocidal surface may comprise a coating comprising metal nanoparticle agglomerates adhered via an adhesive to at least a portion of a surface of the article. A coating formulation comprising metal nanoparticle agglomerates may be applied to the surface of an article to accomplish the foregoing.

A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

Disclosed herein are method and design rules for making polyelemental systems with specific heterostructures, including tetra-phase nanopartides with as many as six junctions. In accordance with an embodiment, a method of making a tetra-phase polyelemental nanoparticle using tri-phase nanoparticle architectures can include selecting two or more triphase nanoparticle architectures, wherein the two or more tri-phase nanoparticle architectures are one or more striped tri-phase architectures, one or more pie-shaped tri-phase architectures, or combinations thereof; identifying from the selected two or more tri-phase nanoparticle architectures groups of metals for generating each of the two or more tri-phase nanoparticle architectures; contacting a tip coated with an ink to a substrate to form a nanoreactor, the ink comprising block copolymer and the metals from the groups of metals identified for generating each of the two or more tri-phase nanoparticle architectures; and annealing the nanoreactors under conditions sufficient to synthesize a tetra-phase polyelemental nanoparticle.

The invention relates to a flexible polymer composite containing metal particles, to the method for producing said composite, and to the uses of said composite.

A composition for forming a metallic luster film, includes: a thiophene polymer, in which a total content of an Fe atom, a Cu atom, an Mn atom, a Cr atom, and a Ce atom in the composition for forming a metallic luster film is 1500 ppm or less with respect to the thiophene polymer.

Disclosed herein is a A polyalkanolamine including the structure of formula L1

[00001]${\left[{\text{A}}^{\text{L}}\right]}_{\text{n}}{\left[{\text{B}}^{\text{L}}\right]}_{\text{m}}$

wherein A.sup.L is B.sup.L is X.sup.L1, X.sup.L2, X.sup.L3 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; Ar.sup.L is a 5 or 6 membered N-heteroaromatic ring system including from 1 to 4 N atoms, which may be unsubstituted or substituted by C.sub.1 to C.sub.6 alkyl; n is an integer of from 2 to 350; m is 0 or an integer of from 1 to 600; o is 1 or an integer of from 2 to 25; B.sup.L1 is a continuation of the backbone B.sup.L by branching; X.sup.L11, X.sup.L12, X.sup.L13 are independently selected from a C.sub.1 to C.sub.6 alkanediyl; X.sup.L21 is a C.sub.1 to C.sub.6 alkanediyl; and derivatives thereof obtainable by N-protonation, N-quaternization, substitution, or polyalkoxylation.

The invention relates to a multilayer flexible material (of a tape type) which can be applied and adhere onto a surface to modify its properties. Particularly, an antibacterial and/or antiviral multilayers material comprising a tie binding layer with at least one adhesive face arranged to be fixed on any suitable surface and an active treatment layer arranged on the face of the tie binding layer opposite to adhesive face, said treatment layer comprising anti-bacterial and/or anti-viral agents. The invention is also related to an associated application method and specific uses.

A method of producing a connected body, containing: disposing an adhesive film between a first electronic member having a first electronic electrode and a second electronic member having a second electrode; and pressure-bonding the second electronic member to the first electronic member via the adhesive film so that the second electrode is electrically connected to the first electrode; wherein the first electronic member has an indented surface, the first electrode is provided in a depressed portion of the indented surface, the second electrode has a substantially flat surface having an area larger than an area of the first electrode, the adhesive film contains: first conductive particles that are dendritic conductive particles; and second conductive particles containing a non-conductive core and a conductive layer provided on the core, and the second conductive particles have an average particle diameter of not less than a depth of the depressed portion.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.