The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

Disclosed is an antibacterial and anti-shielding composition for a window film. The composition contains: 17.0 to 19.0 parts by weight of a monomer component composed of dipentaerythritol hexaacrylate and N,N-dimethylacrylamide; 0.85 to 0.95 parts by weight of any one or more liquid compounds selected from the group consisting of diphenyl(2,4,6-trimethylbenzoyl) phosphine oxide, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone], 2-hydroxy-2-methylpropiophenone, and 2,4,6-trimethylbenzophenone; 0.35 to 0.40 parts by weight of 1-hydroxycyclohexylphenylketone; 0.15 to 0.20 parts by weight of phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; 0.04 to 0.06 parts by weight of 2-propenoic acid, butyl ester; 50.0 to 78.0 parts by weight of a liquid heat-shielding agent; and 2.0 to 2.5 parts by weight of an antibacterial agent. Also disclosed are a method of producing a window film using the composition, and a window film produced thereby.

A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Formulations comprising from 10 to 80% by weight of the formulation of a halogenated epoxy resin; from 1 to 15% by weight of the formulation of an antimony based fire retardant; from 1 to 10% by weight of the formulation of an inorganic or non-polymeric organic phosphorous containing fire retardant; and from 1 to 30% by weight of the formulation of a curative system are provided. The formulations are particularly suitable for producing aircraft interior composite components having good fire retarding properties, low smoke emission, low smoke toxicity and low heat release properties. The formulations also have excellent processing and mechanical properties. Further components may be included in the compositions to improve various properties, including the fire retarding, low smoke emission, low smoke toxicity and low heat release properties and to also further improve the processing and mechanical properties, including toughness. Compositions produced from the formulations have excellent processing and mechanical properties, and may also have good surface finishes.

A thermoplastic composition includes 40 to 70 wt % of a polyester; 5 to 50 wt % of a poly(carbonate-siloxane), a poly(carbonate-siloxane-arylate), or a combination thereof; and 0.1 to 8 wt % of an additive comprising a processing aid, a heat stabilizer, an antioxidant, an ultra violet light absorber, or a combination thereof. An ASTM tensile bar comprising the composition has a tensile strength retention of at least 90% and a tensile elongation at break retention of at least 80% after exposure of the bar for 7 days to SANI-CLOTH AF3 at a temperature of 23° C. under 1% strain compared to a non-exposed reference tested at the same temperature. An article comprising the thermoplastic composition is also described.

The present invention is to provide a rubber composition that can be a conveyor belt having excellent heat resistance and wear resistance, and a conveyor belt. An embodiment of the present invention is a rubber composition for a conveyor belt containing: per 100 parts by mass of a rubber component containing at least an ethylene-1-butene copolymer, from 1 to 10 parts by mass of antimony trioxide, and from 10 to 50 parts by mass of a compound represented by Formula (1). In Formula (1), R represents an aliphatic hydrocarbon group that may contain an unsaturated bond.

##STR00001##

A flame-retardant resin composition, comprising the following components (A) to (D), wherein the content of the component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the component (A), the content of the component (C) is 1.5 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the component (A), and the content of the component (D) is 1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the component (A): (A) polypropylene (B) a brominated flame-retardant having isocyanurate structure (C) a pigment (D) a flame-retardant synergist

A flame-retardant resin composition, comprising the following components (A) to (D), wherein the content of the component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the component (A), the content of the component (C) is 1.5 parts by mass or more and 10 parts by mass or less based on 100 parts by mass of the component (A), and the content of the component (D) is 1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the component (A): (A) polypropylene (B) a brominated flame-retardant having isocyanurate structure (C) a pigment (D) a flame-retardant synergist

The solid content contains a resin component (A) and a filler (B). The resin component (A) includes at least one of a fluorine-containing copolymer (a1) or a silicon-containing copolymer (a2). The fluorine-containing copolymer (a1) includes a fluorine-containing segment and an acrylic segment containing no fluorine or silicon. The silicon-containing copolymer (a2) includes a silicon-containing segment and an acrylic segment containing no fluorine or silicon. The filler (B) has a mean particle size falling within a range from 10 nm to 200 nm.

A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.