A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa.Math.s or more and 2,000 mPa.Math.s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.

A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.

The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10.sup.−7 m.sup.2s.sup.−1 or more, and has a volume resistivity of 1.0×10.sup.11 Ω.Math.cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.