Patent classifications
C08K2003/385
THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE
In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.
COATED POLYURETHANE FOAMS
Articles useful for bedding and other comfort applications include a coated polyurethane foam. The coating includes an elastomeric polymer, a phase change material and ceramic particles. The coating provides desirable haptic properties, including a cool touch feature that creates a sensation of coolness when touched. The invention is also a coating composition for producing such a coating, and a method for producing the coating composition
HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET
A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.
Hexagonal boron nitride powder, method for producing same, resin composition and resin sheet
A hexagonal boron nitride powder having an average longer diameter (L) of primary particles in the hexagonal boron nitride powder of more than 10.0 μm and 30.0 μm or less, an average thickness (D) of the primary particles in the hexagonal boron nitride powder of 1.0 μm or more, a ratio of the average longer diameter (L) to the average thickness (D), [L/D], of 3.0 or more and 5.0 or less, and a content of primary particles having a ratio of a longer diameter (1) to a thickness (d), [l/d], of 3.0 or more and 5.0 or less of 25% or more, a method for producing the hexagonal boron nitride powder, and a resin composition and a resin sheet each containing the hexagonal boron nitride powder.
Two-Dimensional Sheet Stabilized Emulsion Based Inks
The present disclosure provides advantageous sheet stabilized emulsion based inks, and improved methods for fabricating and using such inks. More particularly, the present disclosure provides improved methods for fabricating conductive inks derived from water-in-oil emulsions stabilized by sheets exfoliated from layered materials (e.g., substantially pristine and non-oxidized graphite or hexagonal boron nitride), and related methods of use. A layered material (e.g., substantially pristine and non-oxidized graphite or hexagonal boron nitride) can be exfoliated into individual sheets, and these sheets can be utilized to stabilize water-in-oil emulsions. In certain embodiments, by utilizing long chain alkanes (e.g., hexadecane), one can advantageously fabricate emulsions with high viscosity and stability. In this form, the emulsions can be used as inks, thereby advantageously providing an inexpensive route to printing electrically conducting and/or insulating lines and shapes.
ANTI-FRICTION LACQUER AND SLIDING ELEMENT HAVING SUCH AN ANTI-FRICTION LACQUER
An anti-friction lacquer has a resin matrix of a polymer and functional fillers containing mixed-phase oxides having a specified grinding hardness and proportion and optionally contain further functional fillers. A sliding element is also disclosed having a metallic substrate layer and a coating applied to the substrate that is made of at least in part of the anti-friction.
COMPOSITION FOR ADDITIVE MANUFACTURING
Compositions useful for making additive manufactured articles are comprised of a styrenic thermoplastic elastomer, the styrenic thermoplastic elastomer being comprised of a block copolymer being comprised of at least two blocks of a vinyl aromatic monomer and at least one block of a conjugated diene monomer, and a solid particulate filler dispersed therein, wherein the filler has a surface area of 0.05 m.sup.2/g to 120 m.sup.2/g. The compositions may be formed into filaments for use in fused filament fabrication additive manufacturing. The filaments display good printability without drying or storage under dry conditions.
Polymeric insulating films
Insulating films suitable for use in magnet wire, electrical machines, and other applications may include at least one layer formed from extruded material. The extruded material may include a blend of a first polymeric material and a second polymeric material different than the first polymeric material. The first polymeric material may include one of polyetheretherketone, polyaryletherketone, polyetherketoneketone, polyphenylsulfone, polyphenylene sulfide, or polybenzimidazole, and the second polymeric material may include one of polyphenylsulfone, polyetherimide, polyethersulfone, polyphenylene sulfide, polycarbonate, or polyester.
FLOWABLE HARDENABLE COMPOSITION, THERMALLY CONDUCTIVE COMPOSITION, AND ELECTRONIC HEAT SINK ASSEMBLY INCLUDING THE SAME
A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.
Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound
The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.