A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

A thermal interface composition includes a polysiloxane component, a thermal conductive component, a curing agent, a curing accelerator, an organosilicon coupling agent, and a crosslinking agent having three or more epoxy groups. The polysiloxane component includes not lower than 50 wt % and lower than 100 wt % of a first polysiloxane and a second polysiloxane. The thermal conductive component includes not lower than 30 wt % and lower than 70 wt % of a first thermal conductive filler, not lower than 30 wt % and lower than 70 wt % of a second thermal conductive filler, and greater than 0 wt % and not greater than 40 wt % of a third thermal conductive filler. A method for preparing a thermal interface material is also disclosed.

There are provided a carbodiimide compound excellent in storage stability, and performance as a crosslinking agent, and a method for producing the same, and a resin composition excellent in the film forming properties and solvent resistance of a coating made at low temperature. A polycarbodiimide compound derived from an aliphatic diisocyanate compound having at least one primary isocyanate group, the polycarbodiimide compound having a structure in which all ends are capped with an organic compound having a functional group that reacts with an isocyanate group, carbodiimide group concentration A (%) and weight average molecular weight Mw satisfying the following formula (1), and a resin composition comprising the carbodiimide compound and an aqueous resin having a predetermined acid value at a predetermined ratio.
(A/Mw)×1000≥0.55  (1).

There are provided a carbodiimide compound excellent in storage stability, and performance as a crosslinking agent, and a method for producing the same, and a resin composition excellent in the film forming properties and solvent resistance of a coating made at low temperature. A polycarbodiimide compound derived from an aliphatic diisocyanate compound having at least one primary isocyanate group, the polycarbodiimide compound having a structure in which all ends are capped with an organic compound having a functional group that reacts with an isocyanate group, carbodiimide group concentration A (%) and weight average molecular weight Mw satisfying the following formula (1), and a resin composition comprising the carbodiimide compound and an aqueous resin having a predetermined acid value at a predetermined ratio.
(A/Mw)×1000≥0.55  (1).

There is provided herein a curable polysiloxane composition comprising a reactive polysiloxane having the general structural formula (I):

##STR00001##

as described herein. There is provided a method of making the polysiloxane. In addition, there is provided a curable composition including the polysiloxane.

An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R.sup.2.sub.3SiO.sub.1/2 units and SiO.sub.4/2 units, wherein R.sup.2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.

An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R.sup.2.sub.3SiO.sub.1/2 units and SiO.sub.4/2 units, wherein R.sup.2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.

A method of fabricating the organic-inorganic hybrid coating layer includes: preparing a gel mixture including an organic precursor and colloidal silica particles; preparing a first mixed solution by heating the gel mixture; preparing a second mixed solution by adding quantum dots to the first mixed solution; and coating the second mixed solution on a substrate and irradiating light thereon to form a polymer matrix in which the organic precursor and the colloidal silica particles are crosslinked, and preparing a coating layer in which the quantum dots are dispersed in the polymer matrix, wherein the organic precursor may include at least one of dipentaerythritol pentaacrylate (DPPA) or dipentaerythritol hexaacrylate (DPHA).

A method of fabricating the organic-inorganic hybrid coating layer includes: preparing a gel mixture including an organic precursor and colloidal silica particles; preparing a first mixed solution by heating the gel mixture; preparing a second mixed solution by adding quantum dots to the first mixed solution; and coating the second mixed solution on a substrate and irradiating light thereon to form a polymer matrix in which the organic precursor and the colloidal silica particles are crosslinked, and preparing a coating layer in which the quantum dots are dispersed in the polymer matrix, wherein the organic precursor may include at least one of dipentaerythritol pentaacrylate (DPPA) or dipentaerythritol hexaacrylate (DPHA).

The present disclosure relates to a thermosetting composition, an optical member formed therefrom, and a display device, the composition comprising a thermosetting resin, gas-containing particles and a monomer or an oligomer having two or more thermosetting functional groups, thereby having optical effects such as a low refractive index of 1.40 or less on light with a wavelength of 450 nm, high light transmittance, and low haze.