C08K3/36

THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
20230045848 · 2023-02-16 ·

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
20230045848 · 2023-02-16 ·

Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.

HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET
20230052370 · 2023-02-16 · ·

A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATION SHEET
20230052370 · 2023-02-16 · ·

A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME
20230051287 · 2023-02-16 · ·

The present disclosure relates to a modified conjugated diene-based polymer, a method for preparing the same and a rubber composition comprising the same, and the modified conjugated diene-based polymer has narrow molecular weight distribution, and includes S atoms in the specific content in the polymer, a derived unit from an N-containing aromatic hydrocarbon compound, a derived unit from an S-containing aromatic hydrocarbon compound or an S-containing heterocyclic compound.

MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME
20230051287 · 2023-02-16 · ·

The present disclosure relates to a modified conjugated diene-based polymer, a method for preparing the same and a rubber composition comprising the same, and the modified conjugated diene-based polymer has narrow molecular weight distribution, and includes S atoms in the specific content in the polymer, a derived unit from an N-containing aromatic hydrocarbon compound, a derived unit from an S-containing aromatic hydrocarbon compound or an S-containing heterocyclic compound.

MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME
20230051287 · 2023-02-16 · ·

The present disclosure relates to a modified conjugated diene-based polymer, a method for preparing the same and a rubber composition comprising the same, and the modified conjugated diene-based polymer has narrow molecular weight distribution, and includes S atoms in the specific content in the polymer, a derived unit from an N-containing aromatic hydrocarbon compound, a derived unit from an S-containing aromatic hydrocarbon compound or an S-containing heterocyclic compound.

METHOD OF MANUFACTURING RESIN COMPOSITION

A method of manufacturing resin composition includes following operations. A nano-particle filler, a micro-inorganic particle, and a resin are stirred and mixed to form a mixture. The mixture is centrifuged at a high speed to form an upper layer mixing liquid and a lower layer mixing liquid. The upper layer mixing liquid is taken out and obtains the resin composition.

METHOD OF MANUFACTURING RESIN COMPOSITION

A method of manufacturing resin composition includes following operations. A nano-particle filler, a micro-inorganic particle, and a resin are stirred and mixed to form a mixture. The mixture is centrifuged at a high speed to form an upper layer mixing liquid and a lower layer mixing liquid. The upper layer mixing liquid is taken out and obtains the resin composition.

HARD COATING FILM AND IMAGE DISPLAY DEVICE INCLUDING THE SAME
20230051118 · 2023-02-16 ·

The present disclosure relates to a hard coating film capable of providing excellent durability, elastic recovery rate, and abrasion resistance, by including a base layer; a first hard coating layer formed on at least one surface of the base layer and including a fluorine-based UV-curable functional group-containing compound; and a second hard coating layer formed between the base layer and the first hard coating layer and including inorganic particles; and an image display device including the hard coating film.