A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

One of the objects of the present invention is to provide a fiber treatment agent consisting of an aqueous silicone dispersion capable of quickly forming a silicone elastomer coating having elongation and strength on room-temperature drying and to provide a coating which is the dry product. Further, the object of the present invention is to provide a coating on room-temperature drying without using a high activity catalyst such as organotin compounds. The present invention provides a fiber treatment agent comprising 100 parts by mass of (A) a silicone elastomer which is an addition-reaction product of the following component (A-1) with the following components (A-2) and (A-3): (A-1) an alkenyl group-containing organopolysiloxane having two or more alkenyl groups per molecule, (A-2) an organohydrogen polysiloxane having three or more hydrosilyl groups per molecule, (A-3) a linear diorganohydrogen polysiloxane having hydrosilyl groups only at both molecular chain terminals; 0.1 to 8 parts by mass of at least one surfactant selected from (B) anionic surfactants and (C) nonionic surfactants, 3 to 35 parts by mass of (D) colloidal silica, and 15 to 200 parts by mass of (E) water, relative to total 100 parts by mass of components (A) and (D).

The present invention relates to silica aerogels with a high to very high loading (55-90% w/w) of encapsulated biocidal and/or biorepellant compounds and very low thermal conductivity and to methods of making and using such aerogels in anti-fouling compositions, which are especially suitable for coatings (marine paints, coatings, sealants, lacquers, wood protection or similar controlled leaching systems) that are naturally exposed to humid conditions and/or water, including sea water, and thus prone to fouling.

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A curable silicone adhesive composition comprising a combination of adhesion promoters is shown and described herein. The composition includes a first adhesion promoter selected from a silicon hydride adhesion promoter and a second adhesion promoter selected from an acrylate functional adhesion promoter to provide a silicone material that is curable at relatively low temperatures and shorter time and provides good adhesion to plastics and metal.

A mixture curable to provide a fibre reinforced coating material for protecting a substrate. The mixture comprises a phenolic resin or a polyfurfuryl alcohol resin, a hardener, a thixotropic additive, and fibres.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.

In an aspect, a dielectric composite comprises a thermoset epoxy resin; a reinforcing layer; greater than or equal 40 volume percent of a hexagonal boron nitride based on the total volume of the dielectric composite minus the reinforcing layer; 3 to 7.5 volume percent of a fused silica based on the total volume of the dielectric composite minus the reinforcing layer; an epoxy silane; an accelerator; and a de-aerator. The hexagonal boron nitride can comprise a plurality of hexagonal boron nitride platelets and a plurality of hexagonal boron nitride agglomerates. A volume ratio of the hexagonal boron nitride agglomerates to the hexagonal boron nitride platelets can be 1:1.5 to 4:1.